IS2064 datasheet(53/74 Pages) MICROCHIP

53 / 74 page

 2016 Microchip Technology Inc.

Advance Information

DS60001409A - Page 53

IS2062/64

10.0

REFLOW PROFILE AND

STORAGE CONDITION

Figure 10-1 and Figure 10-2 illustrate reflow profiles

and stencil information of the IS2062/64 SoC.

10.1

Stencil of SMT Assembly

Suggestion

10.1.1

STENCIL TYPE & THICKNESS

• Laser cutting

• Stainless steel

• Thickness: 0.5 mm Pitch, thickness more than

0.15 mm

10.1.2

APERTURE SIZE AND SHAPE FOR

TERMINAL PAD

• Aspect ratio (width/thickness) more than 1.5

• Aperture shape

- The stencil aperture is designed to match the

pad size on the PCB

- Oval-shape opening is used to get the opti-

mum paste release

- Rounded corners to minimize clogging

- Positive taper walls (5

° tapering) with bottom

opening larger than the top

10.1.3

APERTURE DESIGN FOR THERMAL

PAD

• Small multiple openings are used instead of one

big opening, see Figure 10-1

• 60~80% solder paste coverage

• Rounded corners to minimize clogging

• Positive taper walls (5° tapering) with bottom

opening larger than the top, see Figure 10-2

FIGURE 10-1:

REFLOW PROFILE APERTURE DESIGN

FIGURE 10-2:

STENCIL TYPE

IS2062_64.book Page 53 Monday, May 16, 2016 6:05 PM

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