ADF5901

Data Sheet

Rev. A | Page 26 of 26

OUTLINE DIMENSIONS

Figure 32. 32-Lead Lead Frame Chip Scale Package [LFCSP_WQ]

5 mm × 5 mm Body, Very Very Thin Quad

(CP-32-12)

ORDERING GUIDE

Temperature Range

Package Description

Package Option

ADF5901WCCPZ

−40°C to +105°C

32-Lead Lead Frame Chip Scale Package [LFCSP_WQ]

CP-32-12

ADF5901WCCPZ-RL7

−40°C to +105°C

32-Lead Lead Frame Chip Scale Package [LFCSP_WQ]

CP-32-12

EV-ADF5901SD2Z

Evaluation Board

1

Z = RoHS Compliant Part.

AUTOMOTIVE PRODUCTS

The ADF5901W models are available with controlled manufacturing to support the quality and reliability requirements of automotive

applications. Note that these automotive models may have specifications that differ from the commercial models; therefore, designers

should review the Specifications section of this data sheet carefully. Only the automotive grade products shown are available for use in

automotive applications. Contact your local Analog Devices account representative for specific product ordering information and to

obtain the specific Automotive Reliability reports for these models.

0.50

0.40

0.30

1

0.50

BSC

BOTTOM VIEW

TOP VIEW

PIN 1

INDICATOR

32

9

16

17

24

25

8

EXPOSED

PAD

PIN 1

INDICATOR

SEATING

PLANE

0.05 MAX

0.02 NOM

0.20 REF

COPLANARITY

0.08

0.30

0.25

0.18

5.10

5.00 SQ

4.90

0.80

0.75

0.70

FOR PROPER CONNECTION OF

THE EXPOSED PAD, REFER TO

THE PIN CONFIGURATION AND

FUNCTION DESCRIPTIONS

SECTION OF THIS DATA SHEET.

0.25 MIN

3.75

3.60 SQ

3.55

COMPLIANT TO JEDEC STANDARDS MO-220-WHHD-5.

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and registered trademarks are the property of their respective

owners.

D13336-0-7/16(A)