TS8388BCGL datasheet(44/57 Pages) ATMEL

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TS8388B

2144C–BDC–04/03

CBGA68 Board

Assembly with

External Heasink

It is recommended to use an external heatsink or PCBoard special design.

Cooling system efficiency can be monitored using the Temperature Sensing Diode, integrated

in the device.

Figure 49. CBGA68 Board Assembly

Moisture

Characteristics

This device is sensitive to the moisture (MSL3 according to JEDEC standard):

Shelf life in sealed bag: 12 months at <40

°C and <90% relative humidity (RH).

After this bag is opened, devices that will be subjected to infrared reflow, vapor-phase reflow,

or equivalent processing (peak package body temperature 220

°C) must be:

•

mounted within 198 hours at factory conditions of

≤30°C/60% RH, or

•stored at

≤20% RH.

Devices require baking, before mounting, if Humidity Indicator Card is >20% when read at

°C ±5°C.

If baking is required, devices may be baked for:

•

192 hours at 40

°C +5°C/-0°C and <5% RH for low-temperature device containers, or

•

24 hours at 125

°C ±5°C for high temperature device containers.

32.5

Board

50.5

20.2

24.2

TS8388BCGL Datasheet(PDF) 44 Page - ATMEL Corporation