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TS8388BCGL Datasheet(PDF) 53 Page - ATMEL Corporation |
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TS8388BCGL Datasheet(HTML) 53 Page - ATMEL Corporation |
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53 / 57 page ![]() 53 TS8388B 2144C–BDC–04/03 Outline Descriptions Figure 54. Package Dimension – 68 Pins CBGA CBGA 68 package. AL203 substrate. Package design. Corner balls (x4) are not connected (mechanical ball). Balls : 1.27 mm pitch on 11x11 grid. View balls side Top side with soldered R, C devices (using solder Sn/Pb 63/37) Balls side Balls Sn/Pb 63/37 AI203 substrate AI203 Ceramic Cap. Glued and embedded in substrate 0.63 ± 0.10 All units in mm 1.45 ± 0.12 15.00 ± 0.15 mm 72x ∅ D = 0.80 ± 0.10 mm AB C D E F G H J K L 1 2 3 4 5 6 7 8 9 10 11 Ball A1 Index other side 1.27 ref 1.27 7.84 - B - Detail of ball x2 0.40 0.15 TA B T (Position of array of balls / edges A and B) (Position of balls within array) - A - 0.95 max - T - |
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