TS8388BCGL datasheet(47/57 Pages) ATMEL

47 / 57 page

TS8388B

2144C–BDC–04/03

Enhanced CQFP68

Thermal

Characteristics

Enhanced CQFP68

The CQFP68 has been modified, in order to improve the thermal characteristics:

•

A CuW heatspreader has been added at the bottom of the package.

•

The die has been electrically isolated with the ALN substrate.

Thermal Resistance

from Junction to

Case: RTHJC

Typical value for Rthjc is given to 1.56

°C/W.

This value does not include thermal contact resistance between package and external compo-

nent (heatsink or PCBoard).

As an example, 2.0

°C/W can be taken for 50 µm of thermal grease.

Heatsink

It is recommended to use an external heatsink, or PCBoard special design.

The stand off has been calculated to permit the simultaneous soldering of the leads and of the

heatspreader with the solder paste.

Figure 52. Enhanced CQFP68 Suggested Assembly

Cooling system efficiency can be monitored using the Temperature Sensing Diode, integrated

in the device.

Printed

circuit board

CuW heatspreader

28.78

Thermal via

Solid ground plane

24.13

TS8388BCGL Datasheet(PDF) 47 Page - ATMEL Corporation