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AD9655 Datasheet(PDF) 37 Page - Analog Devices |
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AD9655 Datasheet(HTML) 37 Page - Analog Devices |
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37 / 38 page ![]() AD9655 Data Sheet Rev. 0 | Page 36 of 37 APPLICATIONS INFORMATION DESIGN GUIDELINES Before starting design and layout of the AD9655 as a system, it is recommended that the designer become familiar with these guidelines, which describe the special circuit connections and layout requirements needed for certain pins. POWER AND GROUND GUIDELINES When connecting power to the AD9655, it is recommended that two separate 1.8 V supplies be used. Use one supply for analog (AVDD); use a separate supply for the digital outputs (DRVDD). For both AVDD and DRVDD, use several different bypass capacitor values to cover both high and low frequencies. Place these capacitors close to the point of entry at the PCB level and close to the pins of the device, with minimal trace length. A single PCB ground plane is sufficient when using the AD9655. With proper bypassing and smart partitioning of the PCB analog, digital, and clock sections, optimum performance is easily achieved. CLOCK STABILITY CONSIDERATIONS When powered on, the AD9655 enters an initialization phase during which an internal state machine sets up the biases and the registers for proper operation. During the initialization process, the AD9655 needs a stable clock. If the ADC clock source is not present or not stable during ADC power-up, it disrupts the state machine and causes the ADC to start up in an unknown state. To correct this, reinvoke an initialization sequence after the ADC clock is stable by issuing a digital reset via Register 0x08. In the default configuration (internal VREF, ac- coupled input) where VREF and VCM are supplied by the ADC, a stable clock during power-up is sufficient. WhenVCM is supplied by an external source, this, too, must be stable at power-up; otherwise, a subsequent digital reset via Register 0x08 is needed. Clock instability during normal operation may also necessitate digital reset to restore proper operation. The pseudo code sequence for a digital reset is as follows: 1. SPI_Write (0x08, 0x03)—digital reset. 2. SPI_Write (0x08, 0x00)—normal operation. EXPOSED PAD THERMAL HEAT SLUG RECOMMENDATIONS It is required that the exposed pad on the underside of the ADC be connected to analog ground (AGND) to achieve the best electrical and thermal performance of the AD9655. It is recommended that an exposed continuous copper plane on the PCB mate to the AD9655 exposed pad, Pin 0. It is also recommended that this copper plane have several vias to achieve the lowest possible resistive thermal path for heat dissipation to flow through the bottom of the PCB. Solder-fill or plug these vias. To maximize the coverage and adhesion between the ADC and PCB, partition the continuous copper plane by overlaying a silkscreen or solder mask on the PCB into several uniform sections. This provides several tie points between the ADC and PCB during the reflow process, whereas using one continuous plane with no partitions only guarantees one tie point. See Figure 69 for a PCB layout example. For detailed information on packaging and the PCB layout of chip scale packages, see the AN-772 Application Note, A Design and Manufacturing Guide for the Lead Frame Chip Scale Package (LFCSP). SILKSCREEN PARTITION PIN 1 INDICATOR Figure 69. Typical PCB Layout VCM Bypass the VCM pin to ground with a 0.1 μF capacitor. REFERENCE BYPASSING Externally bypass the VREF pin to ground with a low ESR, 1.0 μF capacitor in parallel with a low ESR, 0.1 μF ceramic capacitor. SPI PORT The SPI port must not be active during periods when the full dynamic performance of the converter is required. Because the SCLK, CSB, and SDIO signals are typically asynchronous to the ADC clock, noise from these signals can degrade converter performance. If the on-board SPI bus is used for other devices, it may be necessary to provide buffers between this bus and the AD9655 to prevent these signals from transitioning at the converter inputs during critical sampling periods. |
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