AD9259 datasheet(11/53 Pages) AD

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AD9259

Data Sheet

Rev. E | Page 10 of 52

ABSOLUTE MAXIMUM RATINGS

Table 5.

Parameter

Rating

ELECTRICAL

AVDD to AGND

−0.3 V to +2.0 V

DRVDD to DRGND

−0.3 V to +2.0 V

AGND to DRGND

−0.3 V to +0.3 V

AVDD to DRVDD

−2.0 V to +2.0 V

Digital Outputs1 to DRGND

−0.3 V to +2.0 V

CLK+, CLK− to AGND

−0.3 V to +3.9 V

VIN + x, VIN – x to AGND

−0.3 V to +2.0 V

SDIO/ODM to AGND

−0.3 V to +2.0 V

PDWN, SCLK/DTP, CSB to AGND

−0.3 V to +3.9 V

REFT, REFB, RBIAS to AGND

−0.3 V to +2.0 V

VREF, SENSE to AGND

−0.3 V to +2.0 V

ENVIRONMENTAL

Operating Temperature

Range (Ambient)

−40°C to +85°C

Maximum Junction

Temperature

150°C

Lead Temperature

(Soldering, 10 sec)

300°C

Storage Temperature

Range (Ambient)

−65°C to +150°C

Digital outputs include D + x, D − x, DCO+, DCO−, FCO+, FCO−.

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

THERMAL IMPEDANCE

Table 6.

Air Flow Velocity (m/sec)

θJA1

θJB

θJC

Unit

0.0

°C/W

1.0

12.6

1.2

°C/W

2.5

°C/W

θJA for a 4-layer PCB with solid ground plane (simulated). Exposed pad

soldered to PCB.

ESD CAUTION

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