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AFD4400 Datasheet(PDF) 62 Page - NXP Semiconductors |
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AFD4400 Datasheet(HTML) 62 Page - NXP Semiconductors |
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62 / 101 page ![]() AFD4400 Digital Front End Processor Data Sheet, Rev. 0 Electrical characteristics Freescale Semiconductor 62 This figure shows the RGMII AC timing and multiplexing diagrams. Figure 17. RGMII timing and multiplexing diagrams Clock period duration tRGT 7.2 8.0 8.8 ns 3 Duty cycle for 10BASE-T and 100BASE-TX tRGTH/tRGT 40 50 60 % 3,4 Duty cycle for Gigabit tRGTH/tRGT 45 50 55 % — Note: 2. This implies that the PC board design requires clocks to be routed such that an additional trace delay greater than 1.5 ns is added to the associated clock signal. Many PHY vendors already incorporate the necessary delay inside their chip. If so, additional PCB delay is probably not needed. 3. For 10 and 100 Mbps, tRGT scales to 400 ns ± 40 ns and 40 ns ± 4 ns, respectively. 4. Duty cycle may be stretched/shrunk during speed changes or while transitioning to a received packet's clock domains as long as the minimum duty cycle is not violated and stretching occurs for no more than three tRGT of the lowest speed transitioned between. 5. The frequency of TSEC1_RX_CLK (input) should not exceed the frequency of TSEC1_GTX_CLK (output) by more than 300 ppm. Table 38. RGMII AC timing specifications (continued) Parameter Symbol Min Typ Max Unit Notes TSEC1_GTX_CLK tRGT tRGTH tSKRGT_TX TSEC1_TX_CTL TXD[8:5] TXD[7:4] TXD[9] TXERR TXD[4] TXEN TXD[3:0] (At MAC, output) TSEC1_TXD[8:5][3:0] TSEC1_TXD[7:4][3:0] TSEC1_TX_CLK (At PHY, input) TSEC1_RX_CTL RXD[8:5] RXD[7:4] RXD[9] RXERR RXD[4] RXDV RXD[3:0] TSEC1_RX_CLK (At MAC, input) tSKRGT_RX tRGTH tRGT TSEC1_RX_CLK (At PHY, output) TSEC1_RXD[8:5][3:0] TSEC1_RXD[7:4][3:0] tSKRGT_RX PHY equivalent to tSKRGT_TX tSKRGT_TX PHY equivalent to tSKRGT_RX PHY equivalent to tSKRGT_RX (At MAC, output) (At MAC, output) (At PHY, output) (At PHY, output) PHY equivalent to tSKRGT_TX |
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