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Proprietary to OmniVision Technologies
Version 1.3, September 15, 2003
OV9625/OV9121
CMOS SXGA (1.3 MPixel) CAMERACHIP™
Omni
ision
Package Specifications
The OV9625/OV9121 uses a 48-pin ceramic package. Refer to Figure 21 for package information and Figure 22 for the array
center on the chip.
Figure 21 OV9625/OV9121 Package Specifications
Table 12
OV9625/OV9121 Package Dimensions
Dimensions
Millimeters (mm)
Inches (in.)
Package Size
14.22 + 0.30 / -0.13 SQ
.560 + .012 / - .005 SQ
Package Height
2.23 + 0.28
.088 + .011
Substrate Height
0.51 + 0.05
.020 + .002
Cavity Size
8.89 + 0.13 SQ
.350 + .005 SQ
Castellation Height
1.14 + 0.13
.045 + .005
Pin #1 Pad Size
0.51 x 2.16
.020 x .085
Pad Size
0.51 x 1.02
.020 x .040
Pad Pitch
1.02 + 0.08
.040 + .003
Package Edge to First Lead Center
1.524 + 0.25 / -0.13
.06 + .010 / - .005
End-to-End Pad Center-Center
11.18 + 0.13
.440 + .005
Glass Size
12.40 + 0.10 SQ / 13.00 + 0.10 SQ
.488 + .004 SQ / .512 + .004 SQ
Glass Height
0.55 + 0.05
.022 + .002
.022 ± .004
0.0287
Image
Plane
.001 to .005 TYP
.030 ± .002
.065 ± .007
.088 ± .011
.020 ± .002
.015 ± .002
31
1
19
30
31
42
.350 SQ ± .005
.430 SQ ± .005
30
42
.032 MIN
43
43
19
18
18
48
48
1
6
6
7
7
.560 SQ + .012 / - .005
Pin 1
Index
.06 + .010 / - .005
.085 TYP
R .0075
(48 PLCS)
R .0075
(4 CORNERS)
.040 TYP
.040 ± .003
31
42
30
19
.440 ± .005
43
48
1
6
7
18
.020 TYP
.488
.012 TYP
REF
± .004
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