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Package Specifications
Version 1.3, September 15, 2003
Proprietary to OmniVision Technologies
29
Omni
ision
Sensor Array Center
Figure 22 OV9625/OV9121 Sensor Array Center
NOTE: Picture is for reference only, not to scale.
Die shift (x,y) = 0.15 mm (6 mils) max.
Die tilt = 1 degrees max.
Die rotation = 3 degrees max.
Package Center
(0, 0)
Sensor
Array
Package
Positional Tolerances
Pin 1
1
Die
Important:
Most optical systems invert and mirror the image so the chip is usually
mounted on the board with pin 1 (SVDD) down as shown.
Array Center
(15.7 µm, -271.6 µm)
(0.62 mil, -10.69 mil)