AD9083BBCZ datasheet(13/93 Pages) AD

13 / 93 page

Data Sheet

AD9083

Rev. 0 | Page 13 of 93

ABSOLUTE MAXIMUM RATINGS

Table 15.

Parameter

Rating

Electrical

AVDD to AGND

1.05 V

AVDD1P8 to AGND

2.0 V

DVDD to DGND

1.05 V

DVDD1P8 to DGND

2.0 V

AGND to DGND

−0.3 V to +0.3 V

VINx± to AGND

AGND − 0.3 V to AVDD1P8 + 0.3 V

CLK± to AGND

AGND − 0.3 V to AVDD + 0.3 V

SCLK, SDIO, CSB, RSTB,

PD/STBY to DGND

DGND − 0.3 V to DVDD1P8 + 0.3 V

SYSREF±, TRIG± to AGND

AGND − 0.3 V to AVDD + 0.3 V

SYNCINB± to DGND

DGND − 0.3 V to DVDD1P8 + 0.3 V

Temperature

Junction Range

−40°C to +125°C

Storage Range

(Ambient)

−65°C to +150°C

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the

operational section of this specification is not implied.

Operation beyond the maximum operating conditions for

extended periods may affect product reliability.

THERMAL RESISTANCE

θJA is specified for the worst-case conditions, that is, a device

soldered in a circuit board for surface-mount packages.

Table 16. Thermal Resistance

Package Type

θJA

θJC_TOP

θJB

ΨJB

ΨJT

Unit

BC-100-81

23.4

10.3

8.9

9.0

1.2

°C/W

Test Condition 1: Thermal impedance simulated values are based on JEDEC

2S2P thermal test board with 190 thermal vias. See JEDEC JESD-51.

ESD CAUTION

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