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LTC7151S Datasheet(PDF) 3 Page - Analog Devices |
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LTC7151S Datasheet(HTML) 3 Page - Analog Devices |
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3 / 38 page ![]() LT7182S 3 Rev. 0 For more information www.analog.com PIN CONFIGURATION ABSOLUTE MAXIMUM RATINGS PVIN0, PVIN1............................................... –0.3V to 25V EXTVCC........................................................ –0.3V to 6V VSENSE0P, VSENSE1P ...................................... –0.3V to 6V VSENSE0N, VSENSE1N .................................. –0.3V to 0.3V ITH0, ITH1...................................................... –0.3V to 6V SYNC/PWM_CFG, WP, SHARE_CLK, ALERT, SDA, SCL, FAULT0, FAULT1, RUN0, RUN1, PGOOD0, PGOOD1............................ –0.3V to 6V Operating Junction Temperature (Note 2) LT7182SR .......................................... –40°C to 150°C ABSMAX TJ....................................................... 150°C Storage Temperature Range .................. –65°C to 150°C Maximum Peak Reflow (Package Body) Temperature..........................................................260°C (Note 1) 39 34 41 SW0 44 SW1 42 PGND 43 PGND 38 37 36 35 PGOOD1 FAULT1 WP RUN0 RUN1 EXTVCC FAULT0 ALERT SCL SDA VSENSE0N INTVCC ITH1 ITH0 SGND VOUT0_CFG VDD18 ASEL VOUT1_CFG/ POLYPHASE_CFG VSENSE1N VSENSE1P VSENSE0P TOP VIEW LQFN PACKAGE 40-LEAD (5mm × 7mm × 0.9mm) θJA = 27°C/W, ΨJT = 0.28°C/W, EXPOSED PAD (PINS 41 - 44) MUST BE SOLDERED TO APPROPRIATE PCB NETS 40 33 13 14 15 16 17 18 19 20 32 31 30 29 28 27 26 25 24 23 22 21 1 2 3 4 5 6 7 8 9 10 11 12 SHARE_CLK SYNC/ PWM_CFG ORDER INFORMATION PART NUMBER PAD OR BALL FINISH PART MARKING* PACKAGE TYPE** MSL RATING TEMPERATURE RANGE (SEE NOTE 2) DEVICE FINISH CODE LT7182SRV#PBF Au (RoHS) 7182S e4 LQFN 3 –40°C to 150°C • *Pad or ball finish code is per IPC/JEDEC J-STD-609. The temperature grade is identified by a label on the shipping container. **LQFN is Laminate Package with QFN Footprint. The LT7182S package has the same X, Y dimensions as a standard 5mm × 7mm QFN package. • Recommended LGA and BGA PCB Assembly and Manufacturing Procedures • LGA and BGA Package and Tray Drawings |
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