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LTC4282 Datasheet(PDF) 27 Page - Analog Devices

Part # LTC4282
Description  High Voltage High Current Hot Swap Controller
PDF  32 Pages
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Manufacturer  AD [Analog Devices]
Direct Link  http://www.analog.com
Logo AD - Analog Devices

LTC4282 Datasheet(HTML) 27 Page - Analog Devices

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LTC4238
27
Rev. 0
For more information www.analog.com
capacitor, CF, is placed on the UV pin to prevent supply
glitches from turning off the GATE via UV or OV.
The FB divider is solved by picking R8 and solving for R7,
choosing 5.23k for R8.
R7
=
VPWRGD(UP)
FBTH(RISING)
•R8 – R8
(16)
resulting in R7 = 62k.
Since the fast-current limit comparator is engaged at
120A, the input TVS needs to be capable of clamping a
120A surge at a voltage above the OV threshold but below
the 100V absolute maximum rating of the LTC4238 for
about 1μs. The SMC5K60A clamps 51.7A at 96.8V for
1ms and can dissipate 23kW for 10μs. Three of them are
required to sink 120A current.
In addition, a 0.1µF ceramic bypass capacitor is placed
on the INTVCC pin. No bypass capacitor is required on
the VDD pin.
Example 2: Low Stress Staged Start Mode with Basic
Timer
The second example has a line regulated 48V supply with
the voltage variation of ±10%. The output is a 2.5kW con-
stant power load. VUV(ON) = 36V and VOV(OFF) = 60V as
shown in Figure 6. The load capacitance is specified as CL
= 2500μF. The low stress staged start mode is chosen for
this example since the power exceeds 1500W and there
is no concern of large input steps. In LSSS, the FET bad
timer will run if GATE1 is low and not in ACL (Table 2),
which could happen when the power good voltage hasn’t
been reached. Therefore, the power good voltage is rec-
ommended to be lower than the input UV voltage. In this
example, VPWRGD(UP) is set to 33V. The current in chan-
nel 2 is usually only a small fraction of the maximum load
current, such as 10% or less. For this reason, its cur-
rent contribution during normal operation can be ignored
for the first phase of the design. Later channel 2 can be
accounted for or sized to make up for any shortfall in the
high current (channel 1) path, so that full power (2500W)
can be supplied at minimum input voltage (43V).
The maximum load current is calculated by Equation 17.
IL(MAX) = PL(MAX)/VS(MIN) = 2500W/43V ≈ 58A (17)
With the two channels decoupled (channel 2 dedicated to
start-up and channel 1 dedicated to passing the load cur-
rent), the overall design flow and design considerations in
some individual steps of the low stress staged start mode
are different from the parallel mode.
Step 1. Select sufficient bypass MOSFETs to carry the
maximum load current. For the maximum channel current
of 58A, two IPT015N10N5 (RDS(ON) < 1.5mΩ) devices
result in 1.26W per package, an acceptable dissipation
with airflow.
With full load, the worst-case voltage across the MOSFET
is about 58A • (1.5/2)mΩ = 43.5mV. The threshold for
starting the FET-bad timer is 100mV. There is sufficient
margin to account for inaccuracies before enabling the
TMRFET pull-up current. See detailed design consider-
ations in Example 1, Step 2.
Step 2. Configure the current limit and select the current
sense resistors. The current limit in this example should
cover the maximum load current, with enough margin to
account for device tolerances. Pick the minimum resis-
tance available for a single sense resistor, 200µΩ, which is
a metal element resistor. Select the current limit threshold
voltage by first assuming channel 1 carries the maximum
load current, then add a small current carried by the start-
up channel for the margin.
ΔVSENSE(MIN) = RS1 • IL(MAX) = 200µΩ • 58A ≈ 12mV
(18)
The resistor power dissipation of channel 1 is given by
Equation 21.
PS1 = ΔVSENSE(MIN) • IL(MAX) = 12mV • 58A = 696mW (19)
Which is well within the power limit of several Watts for
a metal element sense resistor.
As a last step, a 4mΩ sense resistor is chosen for a chan-
nel 2 current:
ILIM1=
∆VSENSE
RS2
=
12mV
4mΩ
= 3A
(20)
APPLICATIONS INFORMATION



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