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LTC4282 Datasheet(PDF) 29 Page - Analog Devices

Part # LTC4282
Description  High Voltage High Current Hot Swap Controller
PDF  32 Pages
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Manufacturer  AD [Analog Devices]
Direct Link  http://www.analog.com
Logo AD - Analog Devices

LTC4282 Datasheet(HTML) 29 Page - Analog Devices

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LTC4238
29
Rev. 0
For more information www.analog.com
Second, check the temperature rise in channel 1 after
startup when TMR times out under different overload
conditions. In this example, IPT015N10N5 can take 60A
with 40V across it for 100µs. The temperature rise in 20µs
is insignificant under overload conditions. If the worst-
case temperature rise in channel 1 is too high, better SOA
MOSFET(s) must be selected for it.
Layout Considerations
For high current applications, PCB layout plays a critical
role in minimizing current congestion as well as partition-
ing the current between two channels. In parallel mode,
to achieve the even split of current flow between the two
channels, the two high current paths should have very
similar layouts for the RSENSE and MOSFET placements.
To achieve accurate current sensing, Kelvin connec-
tions are also required. The SENSE+ and SENSE– lines
should be laid out as differential signal pair. Their trace
lengths to LTC4238 pins should be as short as possible.
The minimum trace width for 1oz copper foil is 0.02" per
amp to make sure the trace stays at a reasonable tem-
perature. Using 0.03" per amp or wider is recommended.
Note that 1oz copper exhibits a sheet resistance of about
530μΩ/. Small resistances add up quickly in high cur-
rent applications.
To improve noise immunity, place the resistive voltage
dividers for the UV, OV and FB pins close to the device and
keep traces to VDD and GND short. It is also important
to put the INTVCC bypass capacitor as close as possible
between the INTVCC and GND pins. A 0.1μF capacitor,
CF, from the UV pin (and OV pin through resistor R2)
to GND also helps reject supply noise. Figure 11 shows
a layout that addresses these issues. Note that a surge
suppressor, Z1, is placed between supply and ground
using wide traces.
It is advised to avoid placing the ground plane under the
power MOSFETs. If the MOSFETs overheat, the insulation
could fail between the input voltage at their drains and an
underlying ground plane. This could create a catastrophic
short across the supply.
APPLICATIONS INFORMATION
Figure 11. Recommended PCB Layout
4238 F11
Z1
R3
R2
CF
R1
R8
SENSE RESISTOR RS
ILOAD
ILOAD
GND
VIN
UV
OV
FB



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