ADP2140

Data Sheet

Rev. B | Page 6 of 32

PIN CONFIGURATION AND FUNCTION DESCRIPTIONS

VIN1

PG

EN1

EN2

VOUT2

10

9

8

7

6

PGND

SW

AGND

FB

VIN2

1

2

3

4

5

ADP2140

TOP VIEW

(Not to Scale)

NOTES

1. THE EXPOSED PAD ON THE BOTTOM OF THE LFCSP PACKAGE ENHANCES

THERMAL PERFORMANCE AND IS ELECTRICALLY CONNECTED TO GROUND

INSIDE THE PACKAGE. IT IS RECOMMENDED THAT THE EXPOSED PAD BE

CONNECTED TO THE GROUND PLANE ON THE CIRCUIT BOARD.

Figure 3. Pin Configuration

Table 5. Pin Function Descriptions

Pin

Mnemonic

Description

1

PGND

Power Ground.

2

SW

Connection from Power MOSFETs to Inductor.

3

AGND

Analog Ground.

4

FB

Feedback from Buck Output.

5

VIN2

LDO Input Voltage.

6

VOUT2

LDO Output Voltage.

7

EN2

Logic 1 to Enable LDO or No Connect for Autosequencing.

8

EN1

Logic 1 to Enable Buck or Initiate Sequencing. This is a dual function pin and the state of EN2 determines

which function is operational.

9

PG

Power Good. Open-drain output. PG is held low until both output voltages (which includes the external

inductor and capacitor sensed by the FB pin) rise above 92% of nominal value. PG is held high until both

outputs fall below 85% of nominal value.

10

VIN1

Analog Power Input.

EP

Exposed Pad. The exposed pad on the bottom of the LFCSP package enhances thermal performance and is

electrically connected to ground inside the package. It is recommended that the exposed pad be connected

to the ground plane on the circuit board.