MCT8316Z datasheet(88/100 Pages) TI

88 / 100 page

11 Layout

11.1 Layout Guidelines

The bulk capacitor should be placed to minimize the distance of the high-current path through the motor driver

device. The connecting metal trace widths should be as wide as possible, and numerous vias should be used

when connecting PCB layers. These practices minimize inductance and allow the bulk capacitor to deliver high

current.

Small-value capacitors such as the charge pump, AVDD, and VREF capacitors should be ceramic and placed

closely to device pins.

The high-current device outputs should use wide metal traces.

To reduce noise coupling and EMI interference from large transient currents into small-current signal paths,

grounding should be partitioned between PGND and AGND. TI recommends connecting all non-power stage

circuitry (including the thermal pad) to AGND to reduce parasitic effects and improve power dissipation from the

device. Optionally, GND_BK can be split. Ensure grounds are connected through net-ties or wide resistors to

reduce voltage offsets and maintain gate driver performance.

The device thermal pad should be soldered to the PCB top-layer ground plane. Multiple vias should be used to

connect to a large bottom-layer ground plane. The use of large metal planes and multiple vias helps dissipate

the I2 × RDS(on) heat that is generated in the device.

To improve thermal performance, maximize the ground area that is connected to the thermal pad ground across

all possible layers of the PCB. Using thick copper pours can lower the junction-to-air thermal resistance and

improve thermal dissipation from the die surface.

Separate the SW_BUCK and FB_BUCK traces with ground separation to reduce buck switching from coupling

as noise into the buck outer feedback loop. Widen the FB_BUCK trace as much as possible to allow for faster

load switching.

Recommended Layout Example for VQFN Package shows a layout example for theMCT8316Z-Q1.

MCT8316Z-Q1

SLVSGO3 – DECEMBER 2021

www.ti.com

Submit Document Feedback

Product Folder Links: MCT8316Z-Q1

MCT8316Z Datasheet(PDF) 88 Page - Texas Instruments