AD9161BBCZ datasheet(13/144 Pages) AD

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Data Sheet

AD9161/AD9162

Rev. D | Page 13 of 144

ABSOLUTE MAXIMUM RATINGS

Table 11.

Parameter

Rating

ISET, VREF to VBG_NEG

−0.3 V to VDD25_DAC + 0.3 V

SERDINx±, VTT_1P2,

SYNCOUT±

−0.3 V to SYNC_VDD_3P3 + 0.3 V

OUTPUT± to VNEG_N1P2

−0.3 V to VDD25_DAC −

(VNEG_N1P2) + 0.2 V

SYSREF±

GND − 0.5 V to +2.5 V

CLK± to Ground

−0.3 V to VDD12_CLK + 0.3 V

RESET, IRQ, CS, SCLK, SDIO,

SDO to Ground

−0.3 V to IOVDD + 0.3 V

Junction Temperature1

fDAC = 6 GSPS

105°C

fDAC ≤ 5.1 GSPS

110°C

Ambient Operating

Temperature Range (TA)

−40°C to +85°C

Storage Temperature Range

−65°C to +150°C

VDD12A, VDD12_CLK, DVDD,

VDD_1P2, VTT_1P2,

DVDD_1P2, PLL_LDO_VDD12,

PLL_CLK_VDD12,

BIAS_VDD_1P2 to Ground

−0.3 V to +1.326 V

VDD25_DAC to Ground

−0.3V to +2.625 V

VNEG_N1P2 to Ground

+0.3V to -1.26 V

IOVDD, SYNC_VDD_3P3 to

Ground

−0.3 V to +3.465 V

Some operating modes of the device may cause the device to approach or

exceed the maximum junction temperature during operation at supported

ambient temperatures. Removal of heat from the device may require

additional measures such as active airflow, heat sinks, or other measures.

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

REFLOW PROFILE

The AD9161/AD9162 reflow profile is in accordance with the

JEDEC JESD204B criteria for Pb-free devices. The maximum

reflow temperature is 260°C.

THERMAL MANAGEMENT

The AD9161/AD9162 is a high power device that can dissipate

nearly 3 W depending on the user application and

configuration. Because of the power dissipation, the

AD9161/AD9162 uses an exposed die package to give the

customer the most effective method of controlling the die

temperature. The exposed die allows cooling of the die directly.

Figure 3 shows the profile view of the device mounted to a user

printed circuit board (PCB) and a heat sink (typically the

aluminum case) to keep the junction (exposed die) below the

maximum junction temperature in Table 11.

CUSTOMER CASE (HEAT SINK)

CUSTOMER THERMAL FILLER

SILICON (DIE)

IC PROFILE

PACKAGE SUBSTRATE

CUSTOMER PCB

Figure 3. Typical Thermal Management Solution

THERMAL RESISTANCE

Typical θJA and θJC values are specified for a 4-layer JEDEC 2S2P

high effective thermal conductivity test board for balled

surface-mount packages. θJA is obtained in still air conditions

(JESD51-2). Airflow increases heat dissipation, effectively reducing

θJA. θJC is obtained with the test case temperature monitored at

the bottom of the package.

J −

where:

θJA is the natural convection junction-to-ambient air thermal

resistance measured in a one-cubic foot sealed enclosure.

TJ is the die junction temperature.

TA is the ambient temperature in a still air environment.

P is the total power (heat) dissipated in the chip.

θJC is the junction-to-case thermal resistance. (In the case of

AD9161/AD9162, this is measured at the top of the package on

the bare die.)

TC is the package case temperature. (In the case of AD9161/

AD9162, the temperature is measured on the bare die.)

Table 12. Thermal Resistance

Package Type

θJA

θJC

Unit

BC-165-1

15.4

0.04

°C/W

BC-169-2

14.6

0.02

°C/W

ESD CAUTION

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