3

NXP Semiconductors

MR2001V

1

Orderable parts

Table 1. Orderable part variations

Part number

Temperature (temp)

Package

Notes

MC33MR2001VVK

-40 °C to 125 °C

6.0 x 6.0 mm RCP

(10 x 11 array) 0.5 mm pitch

(1) (2)

Notes

1.

To order parts in Tape & Reel, add R2 to the suffix of the part number.

2.

The device is packaged inside a 6.0 mm x 6.0 mm RCP with 10 x 11 solder balls. The pitch of the solder balls is 0.5 mm.