35

NXP Semiconductors

MR2001V

9.2

PCB and RCP environment

9.2.1

NXP test board

9.2.1.1

RO3003 on FR4

For the NXP test boards a multi-layer PCB composed of 127

μm thick Rogers 3003 on top of standard FR4 core is used. The manufacturer

for these boards is Elekonta/Marek (http://www.elekonta.de/).

Figure 23. RO3003 on Top of a FR4 core

9.2.1.2

Layout rules

The Figure 24 shows the solder ball arrangement including thermal and rf vias of typical PCB. Solder ball locations are shown in magenta

with a label in blue, thermal via's have a wider diameter and are also shown in magenta without any blue label, important gnd via's to

achieve rf perfromance are shown in green. Thermal vias are located in the area where no solder ball is available, so that they can occupay

the full area of a solder ball.

gal. Cu

gal. Cu

Layer

Type

Shape

Geometry

solder ball

~

∅ 300 um

thermal via

>

∅ 200 um, thru PCB

(non filled, or filled)

gnd via for rf performance

∅ 200 um

(non filled, or filled)