AM2634 datasheet(5/164 Pages) TI

5 / 164 page

Table of Contents

1 Features............................................................................1

2 Applications..................................................................... 2

3 Description.......................................................................3

3.1 Functional Block Diagram........................................... 4

4 Revision History.............................................................. 5

5 Device Comparison......................................................... 7

5.1 Related Products........................................................ 8

6 Terminal Configuration and Functions..........................9

6.1 Pin Diagram................................................................ 9

6.2 Pin Attributes.............................................................10

6.3 Signal Descriptions................................................... 36

6.4 Pin Connectivity Requirements.................................63

7 Specifications................................................................ 64

7.1 Absolute Maximum Ratings...................................... 64

7.2 Electrostatic Discharge (ESD) Extended

Automotive Ratings..................................................... 64

7.3 Electrostatic Discharge (ESD) Industrial Ratings......65

7.4 Power-On Hours (POH) Summary............................66

7.5 Recommended Operating Conditions.......................66

7.6 Operating Performance Points..................................66

7.7 Power Consumption Summary................................. 67

7.8 Electrical Characteristics...........................................68

7.9 VPP Specifications for One-Time Programmable

(OTP) eFuses..............................................................74

7.10 Thermal Resistance Characteristics....................... 75

7.11 Timing and Switching Characteristics..................... 76

7.12 Decoupling Capacitor Requirements.................... 148

8 Detailed Description....................................................149

8.1 Overview................................................................. 149

8.2 Processor Subsystems........................................... 150

9 Applications, Implementation, and Layout............... 151

9.1 Device Connection and Layout Fundamentals....... 151

10 Device and Documentation Support........................152

10.1 Device Nomenclature............................................152

10.2 Tools and Software............................................... 156

10.3 Documentation Support........................................ 156

10.4 Support Resources............................................... 156

10.5 Trademarks...........................................................156

10.6 Electrostatic Discharge Caution............................157

10.7 Glossary................................................................157

11 Mechanical, Packaging, and Orderable

Information.................................................................. 158

4 Revision History

Changes from October 18, 2022 to November 18, 2022 (from Revision B (October 2022) to

Revision C (November 2022))

Page

• Global: Changed the document product status from "Advance Information" to "Production Data"................... 1

• Global: Added the following new GPNs: AM2632, AM2632-Q1, AM2631, and AM2631-Q1............................ 1

• (Package Information): Added row for AM2631...ZCZQ1...................................................................................3

• (Device Comparison): Updated/Changed the Arm Cortex-R5F row...................................................................7

• (Device Comparison): Added table note to clarify JTAG Device ID features......................................................7

• (Device Comparison): Updated Arm® Cortex-R5 reference name to R5FSS.....................................................7

• (Device Comparison): Updated Hardware Security Module reference name to HSM........................................7

• (Pin Attributes): Updated/Changed all applicable Ball State After Reset values from "Off / Off / Off" to "Off /

On / Down"........................................................................................................................................................13

• (Pin Attributes): Updated/Changed QSPI0_CLKLB Ball State After Reset value from "Off / Off / Off" to "On /

On / Down"........................................................................................................................................................13

• (Operating Performance Points): Removed M grade row.................................................................................64

• (Power Consumption Summary): Renamed Power Consumption Summary to Power Consumption -

Maximum......................................................................................................................................................... 67

• (Power Consumption Summary): Added Power Consumption - Typical and Power Consumption -

Traction Inverter sections............................................................................................................................... 67

• (Analog-to-Digital Converter (ADC)): Updated Input Conversion MAX Range from "33/18 x VREFFHI V" to

"32/18 x VREFHI V" ............................................................................................................................................68

• (Analog-to-Digital Converter (ADC)): Updated TYP VREFHI input current from "300 µA" to "400 µA"...............68

• (Analog-to-Digital Converter (ADC)): Added TYP Input Leakage value........................................................... 68

• (Analog-to-Digital Converter (ADC)): Updated Power Consumption (VDDA18) TYP value from "500 µA" to

"700 µA"............................................................................................................................................................68

• (Comparator Subsystem A (CMPSSA)): Removed first option for Comparator input range MAX parameter.. 68

• (Comparator Subsystem A (CMPSSA)): Updated DAC static offset error MIN value from "–20 mV" to "–45

mV" and MAX value from "70 mV" to "45 mV"..................................................................................................68

• (Comparator Subsystem A (CMPSSA)): Updated DAC_VREF loading TYP value from "6 kΩ" to "37 kΩ"..... 68

www.ti.com

AM2634, AM2634-Q1, AM2632, AM2632-Q1, AM2631, AM2631-Q1

SPRSP74C – OCTOBER 2022 – REVISED NOVEMBER 2022

Submit Document Feedback

Product Folder Links: AM2634 AM2634-Q1 AM2632 AM2632-Q1 AM2631 AM2631-Q1

AM2634 Datasheet(PDF) 5 Page - Texas Instruments

AM2634 Datasheet(HTML) 5 Page - Texas Instruments

Html Pages

1 2 3 4 5 6 7 8 9 10 11 12 13 14 15 16 17 18 19 20 21 22 23 24 25 26 27 28 29 30 31 32 33 34 35 36 37 38 39 40 41 42 43 44 45 46 47 48 49 50 51 52 53 54 55 56 57 58 59 60 61 62 63 64 65 66 67 68 69 70 71 72 73 74 75 76 77 78 79 80 81 82 83 84 85 86 87 88 89 90 91 92 93 94 95 96 97 98 99 100 ...More

Datasheet Download

Link URL