FT232RN datasheet(33/40 Pages) FTDI

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FT232RN USB UART IC Datasheet

Version 1.0

Document No.: FT_001521 Clearance No.: FTDI#571

Figure 9.2 QFN-32 Package Dimensions

The FT232RNQ is supplied in a RoHS compliant leadless QFN-32 package. The package is lead ( Pb ) free

and uses a ‘green’ compound. The package is fully compliant with European Union directive 2002/95/EC.

This package is nominally 5.00mm x 5.00mm. The solder pads are on a 0.50mm pitch. The above

mechanical drawing shows the QFN-32 package. All dimensions are in millimetres.

The centre pad on the base of the FT232RNQ is not internally connected, and can be left unconnected, or

connected to ground (recommended).

The date code format is YYWW-B where WW = 2-digit week number, YY = 2-digit year number, B = single

letter corresponding to the revision of the device (e.g., A or B or C).

The code XXXXXXX is the manufacturing LOT code. This only applies to devices manufactured after April

2009.

9.3 Solder Reflow Profile

The FT232RN is supplied in Pb free 28 LD SSOP and QFN-32 packages. The recommended solder reflow

profile for both package options is shown in Figure 9.3.

Figure 9.3 FT232RN Solder Reflow Profile

Critical Zone: when

T is in the range

T to T

Time, t (seconds)

T = 25º C to T

Preheat

Ramp Up

Ramp

Down

T Max

T Min

FT232RN Datasheet(PDF) 33 Page - Future Technology Devices International Ltd.