AD8630 datasheet(7/29 Pages) AD

7 / 29 page

Data Sheet

ADA4523-1

Rev. 0 | Page 7 of 29

ABSOLUTE MAXIMUM RATINGS

Table 3.

Parameter

Rating

Supply Voltage, V+ to V−

40 V

Input Voltage

+IN and −IN1

V− − 0.3 V to V+ + 0.3 V

SD and SDCOM

V− − 0.3 V to V+ + 0.3 V

Input Current

+IN and −IN1

±10 mA

SD and SDCOM

±10 mA

Output Short-Circuit Duration2

Indefinite

Temperature Range

Operating

−40°C to +125°C

Junction

−65°C to +150°C

Storage

−65°C to +150°C

Lead Temperature, Soldering (10 sec)

300°C

Electrostatic Discharge (ESD)

Human Body Model (HBM)

4.0 kV

Field Induced Charge Device Model

(FICDM)3

2.0 kV

Limit the input current to less than 10 mA. The input voltage must not

exceed 300 mV beyond the power supply. These limits are set by the ESD

protection structures at the input pins.

A heat sink may be required to keep the junction temperature below the

absolute maximum rating when the output is shorted indefinitely.

JESD22-C101 (ESD FICDM standard of JEDEC) applicable standard.

Stresses at or above those listed under Absolute Maximum

Ratings may cause permanent damage to the product. This is a

stress rating only; functional operation of the product at these

or any other conditions above those indicated in the operational

section of this specification is not implied. Operation beyond

the maximum operating conditions for extended periods may

affect product reliability.

THERMAL RESISTANCE

Thermal performance is directly linked to printed circuit board

(PCB) design and operating environment. Careful attention to

PCB thermal design is required.

θJA is the junction to ambient, thermal resistance.

θJC is the junction to case, thermal resistance. For θJC on the

exposed pad package, such as CP-8-29, heat sink applies to the

package bottom exposed pad only.

Table 4. Thermal Resistance

Package Type1

θJA

θJC

Unit

R-8

120

°C/W

RM-8

163

°C/W

CP-8-29

5.5

°C/W

Measured with JEDEC 4-layer high effective thermal conductivity board.

ESD CAUTION

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