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IMX7DCEC Datasheet(PDF) 26 Page - NXP Semiconductors |
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IMX7DCEC Datasheet(HTML) 26 Page - NXP Semiconductors |
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26 / 161 page ![]() Electrical characteristics i.MX 7Dual Family of Applications Processors Datasheet, Rev. 7, 09/2023 NXP Semiconductors 26 The typical values shown in Table 11 are required for use with NXP BSPs to ensure precise time keeping and USB operation. For RTC_XTALI operation, two clock sources are available. If there is not an externally applied oscillator to RTC_XTALI, the internal oscillator takes over. • On-chip 32 kHz RC oscillator—this clock source has the following characteristics: — Approximately 25 µA more IDD than crystal oscillator — Approximately ±10% tolerance — No external component required — Starts up faster than 32 kHz crystal oscillator — Three configurations for this input: – External oscillator – External crystal coupled to RTC_XTALI and RTC_XTALO – Internal oscillator External crystal oscillator with on-chip support circuit: — At power up, RC oscillator is utilized. After crystal oscillator is stable, the clock circuit switches over to the crystal oscillator automatically. — Higher accuracy than RC oscillator — If no external crystal is present, then the RC oscillator is utilized The decision of choosing a clock source should be taken based on real-time clock use and precision timeout. 4.1.5 Maximum supply currents The Power Virus numbers shown in Table 12 represent a use case designed specifically to show the maximum current consumption possible. All cores are running at the defined maximum frequency and are limited to L1 cache accesses only to ensure no pipeline stalls. Although a valid condition, it would have a very limited practical use case, if at all, and be limited to an extremely low duty cycle unless the intention was to specifically show the worst case power consumption. The MC3xPF3000xxxx, NXP’s power management IC targeted for the i.MX 7Dual family of processors, supports the Power Virus mode operating at 1% duty cycle. Higher duty cycles are allowed, but a robust thermal design is required for the increased system power dissipation. Table 12 represents the maximum momentary current transients on power lines, and should be used for power supply selection. Maximum currents are higher by far than the average power consumption of typical use cases. For typical power consumption information, see the application note, i.MX 7DS Power Consumption Measurement (AN5383). Table 12. Maximum supply currents Power Rail Source Conditions Max Current Unit VDD_ARM From PMIC — 500 mA VDD_SOC From PMIC — 1000 mA |
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