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IMX7DCEC Datasheet(PDF) 1 Page - NXP Semiconductors |
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IMX7DCEC Datasheet(HTML) 1 Page - NXP Semiconductors |
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1 / 161 page  Ordering Information See Table 1 on page 3 MCIMX7DxDVx1nSD MCIMX7DxEVx1nSD NXP Semiconductors Data Sheet: Technical Data Document Number: IMX7DCEC Rev. 7, 09/2023 Package Information Plastic Package BGA 12 x 12 mm, 0.4 mm pitch BGA 19 x 19 mm, 0.75 mm pitch © 2016, 2017, 2019, 2023 NXP B.V. NXP reserves the right to change the detail specifications as may be required to permit improvements in the design of its products. 1 i.MX 7Dual introduction The i.MX 7Dual family of processors represents NXP’s latest achievement in high-performance processing for low-power requirements with a high degree of functional integration. These processors are targeted towards the growing market of connected and portable devices. The i.MX 7Dual family of processors features advanced implementation of the Arm® Cortex®-A7 core, which operates at speeds of up to 1 GHz and 1.2 GHz, depending on the part number. The i.MX 7Dual family provides up to 32-bit DDR3/DDR3L/LPDDR2/LPDDR3-1066 memory interface and a number of other interfaces for connecting peripherals, such as WLAN, Bluetooth, GPS, displays, and camera sensors. i.MX 7Dual Family of Applications Processors Datasheet 1 i.MX 7Dual introduction. . . . . . . . . . . . . . . . . . . . . . . . . . . 1 1.1 Ordering information . . . . . . . . . . . . . . . . . . . . . . . . 3 1.2 Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4 2 Architectural overview. . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 2.1 Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 8 3 Modules list . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9 3.1 Special signal considerations . . . . . . . . . . . . . . . . 16 3.2 Recommended connections for unused analog interfaces. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19 4 Electrical characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 20 4.1 Chip-level conditions . . . . . . . . . . . . . . . . . . . . . . . 20 4.2 Integrated LDO voltage regulator parameters. . . . 40 4.3 PLL electrical characteristics. . . . . . . . . . . . . . . . . 42 4.4 On-chip oscillators. . . . . . . . . . . . . . . . . . . . . . . . . 42 4.5 I/O DC parameters . . . . . . . . . . . . . . . . . . . . . . . . 43 4.6 I/O AC parameters. . . . . . . . . . . . . . . . . . . . . . . . . 47 4.7 Output buffer impedance parameters . . . . . . . . . . 51 4.8 System modules timing . . . . . . . . . . . . . . . . . . . . . 53 4.9 General-purpose media interface (GPMI) timing. . 73 4.10 External peripheral interface parameters . . . . . . . 81 4.11 12-Bit A/D converter (ADC) . . . . . . . . . . . . . . . . . 118 5 Boot mode configuration . . . . . . . . . . . . . . . . . . . . . . . . 119 5.1 Boot mode configuration pins . . . . . . . . . . . . . . . 119 5.2 Boot device interface allocation. . . . . . . . . . . . . . 120 6 Package information and contact assignments . . . . . . 122 6.1 12 x 12 mm package information . . . . . . . . . . . . 122 6.2 19 x 19 mm package information . . . . . . . . . . . . 139 7 Release notes . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 157 |
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