AM69 datasheet(302/312 Pages) TI

302 / 312 page

Changes from December 16, 2023 to June 30, 2024 (from Revision B (DECEMBER 2023) to

Revision C (JUNE 2024))

Page

• Global: Updated/Changed the document product status from "Production Data" to "Production Data Mixed"

("AND" MECH variant package is "Advance Information").................................................................................1

• Global: Added the "AND" 27mm × 27mm MECH variant package support data (ADVANCE INFORMATION) 1

• Global: Deleted the VPFE subsection from Detailed Description section as not applicable to this device....... 1

• (Features): Added MECH package "AND", 1063-pin count, 27mm square, 16-nmFinFET technology bullets

(new)...................................................................................................................................................................1

• (Features): Deleted the "OLDI/LVDS (4 lanes - 2x) and 24-bit RGB parallel interface" bullet under the Display

subsystem supports: ..........................................................................................................................................1

• (Features): Updated/Changed the "Support for 1,2,3, or 4 data lane mode up to ..." bullet from "1.5Gbps" to

"2.5Gbps"............................................................................................................................................................1

• (Device Comparison): Added "AM69A94 (27MM)" and "AM6954 (27MM)" columns and supported features... 6

• (Device Comparison): Updated/changed the Ethernet Interfaces SERDES features and associated footnotes

to clarify the 27MM package columns and supported features additions...........................................................6

• (Device Comparison): Added separate MECHANICAL PACKAGES rows.........................................................6

• (Device Comparison): Added a cross-reference and associated footnote to the Arm A72 Quad Core devices.6

• (Device Comparison): Added a cross-reference to the "Deep Learning Accelerator (32 TOPS)" row for the

AM69A94 device.................................................................................................................................................6

• (Terminal Configuration and Functions/Pin Diagrams): Added pin diagrams and descriptions for both "ALY"

and "AND" packages (Top View)........................................................................................................................ 9

• (Terminal Configuration and Functions/Pin Attributes): Updated/Changed table to include "AND" package

data (new)...........................................................................................................................................................9

• (Terminal Configuration and Functions/Signal Descriptions): Updated/Changed tables to support, where

applicable, "AND" package data (new)...............................................................................................................9

• (Thermal Resistance Characteristics for AND Package): Added new section............................................... 155

• (OSC1 Crystal Electrical Characteristics Table): Updated OSC1 frequencies from finite values to a range from

19.2 MHz to 27 MHz.......................................................................................................................................186

• (Power Distribution Network Implementation Guidance): Updated/Changed the user's guide doc title and ulink

association......................................................................................................................................................290

• (Reset): Added description for four reset pins and two reset status pins....................................................... 290

• (Hardware Design Guide): Added brief description on the design guide use case........................................ 290

• (Device Naming Convention): Updated/Changed the Package Designator for "ALY" to "ALY FCBGA-N1414

(31mm x 31mm) Package"............................................................................................................................. 300

• (Device Naming Convention): Added new Package Designator row for "AND", "AND FCBGA-N1063 (27mm x

27mm) Package (Advance Information)"........................................................................................................300

AM69A, AM69

SPRSP92C – FEBRUARY 2023 – REVISED JUNE 2024

www.ti.com

302

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