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TDA4VM21 Datasheet(PDF) 313 Page - Texas Instruments

Part # TDA4VM21
Description  TDA4VM Processors
PDF  331 Pages
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Manufacturer  TI [Texas Instruments]
Direct Link  http://www.ti.com
Logo TI - Texas Instruments

TDA4VM21 Datasheet(HTML) 313 Page - Texas Instruments

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A
B
MCU_OSPI[x]_CLK
R1
OSPI/QSPI/SPI
device clock input
0
*
Ω
J7ES_OSPI_Board_03
C
D
MCU_OSPI[x]_DQS
OSPI device DQS
E
F
OSPI/QSPI/SPI
device IOy, CS#
MCU_OSPI[x]_D[y],
MCU_OSPI[x]_CSn[z]
* 0 Ω resistor (R1), located as close as possible to the MCU_OSPI[x]_CLK pin, is a placeholder for fine tuning, if needed.
Figure 8-3. OSPI Interface High Level Schematic
8.3.3 SERDES REFCLK Design Guidelines
The following section details the routing guidelines that must be observed when terminating the SERDES
REFCLK and is applicable only when SERDES REFCLK is configured to input mode.
1. 50 Ω to GND is recommended on each leg.
2. Internal AC coupling is always enabled, so external biasing is not needed.
8.3.4 USB VBUS Design Guidelines
The USB 3.1 specification allows the VBUS voltage to be as high as 5.5 V for normal operation, and as high as
20 V when the Power Delivery addendum is supported. Some applications require a max voltage to be 30 V.
The device requires the VBUS signal voltage be scaled down using an external resistor divider (as shown in the
Figure 8-4), which limits the voltage applied to the actual device pin (USB0_VBUS, USB1_VBUS). The tolerance
of these external resistors should be equal to or less than 1%, and the leakage current of zener diode at 5 V
should be less than 100 nA.
www.ti.com
TDA4VM-Q1, TDA4VM
SPRSP36K – SEPTEMBER 2021 – REVISED APRIL 2024
Copyright © 2024 Texas Instruments Incorporated
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Product Folder Links: TDA4VM-Q1 TDA4VM



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