FXLS8971CF datasheet(86/100 Pages) NXP

86 / 100 page

NXP Semiconductors

FXLS8971CF

3-Axis Low-g Accelerometer

18 Soldering information

18.1 Printed circuit board layout and device mounting

Printed circuit board (PCB) layout and device mounting are critical to the overall performance of the design.

The footprint for the surface mount packages must be the correct size as a base for a proper solder connection

between the PCB and the package. The correct size of the surface mount package footprint, along with the

recommended soldering materials and techniques, optimize assembly and minimize the stress on the package

after board mounting.

NXP application note AN1902[1] discusses the QFN package used by the FXLS8971CF.

18.1.1 Overview of soldering considerations

The information provided here is based on experiments executed on QFN devices. They do not represent exact

conditions present at a customer site. Therefore, information herein should be used as guidance only, and

process and design optimizations are recommended to develop an application-specific solution. It should be

noted that with the proper PCB footprint and solder stencil designs, the package self-aligns during the solder

reflow process.

18.1.2 Halogen content

This package is Halogen free, exceeding most industry and customer standards. Halogen Free means that no

homogeneous material within the assembly package shall contain chlorine (Cl) in excess of 700 ppm or 0.07 %

weight/weight or bromine (Br) in excess of 900 ppm or 0.09 % weight/weight.

19 Mounting information

19.1 PCB mounting recommendations

• No additional via, copper layer, solder mask, metal pattern underneath package on the mounted layer of the

PCB.

• Do not place any components or vias within 2 mm of the package land area as it may cause additional

package stress if placed too close to the package land area.

• Signal traces connected to pads should be as symmetric as possible. To have the same length of exposed

trace for all pads, put dummy traces on NC pads .

• Use a standard pick-and-place process and equipment. Do not use a hand soldering process.

• Customers are advised to be cautious about the proximity of screw-down holes to the sensor, and the location

of any press fit to the assembled PCB when in an enclosure. It is important that the assembled PCB remain

flat after assembly to keep electronic operation of the device optimal.

• The PCB should be rated for the multiple lead-free reflow condition with a maximum 260 °C temperature.

• NXP sensors are compliant with Restrictions on Hazardous Substances (RoHS), having halide-free molding

compound (green) and lead-free terminations. These terminations are compatible with tin-lead (Sn-Pb) as

well as tin-silver-copper (Sn-Ag-Cu) solder paste soldering processes. Reflow profiles applicable to those

processes can be used successfully for soldering the devices.

FXLS8971CF

All information provided in this document is subject to legal disclaimers.

Product data sheet

Rev. 2.1 — 7 March 2024

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