ACT8870

Advanced PMU for Microcontrollers

and Solid State Drive Applications

Data Sheet Rev. 7.0, Feb. 18, 2020 | Subject to change without notice

8 of 49

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ABSOLUTE MAXIMUM RATINGS

PARAMETER

VALUE

UNIT

All I/O and Power pins except PGND_B1, PGND_B2, PGND_B3, PGND_B4, GND

-0.3 to 6

V

Grounds: Any PGND referenced to GND

-0.3 to +0.3

V

SW_Bx to PGNDx

-0.3 to VIN_Bx + 1

V

FB_Bx to PGNDx

-0.3 to VIN_Bx +0.3

V

OUT_LDOx to PGNDx

-0.3 to VINx + 0.3

V

EXT_EN, nRESET_AUX1, nRESET_AUX2

-0.3 to VIO_IN + 0.3

V

Junction to Ambient Thermal Resistance, QFN (Note2)

26

°C/W

Junction to Ambient Thermal Resistance, WCSP (Note2)

31

°C/W

Operating Junction Temperature

-40 to 125

°C

Storage Temperature

-55 to 150

°C

Note1: Do not exceed these limits to prevent damage to the device. Exposure to absolute maximum rating conditions for long periods may affect

device reliability.

Note2: Measured on Active-Semi Evaluation Kit

RECOMMENDED OPERATING CONDITIONS

PARAMETER

TEST CONDITIONS

MIN

TYP

MAX

UNIT

VIN, VIN_B1, VIN_B2, VIN_B3, VIN_B4,

VIN_LDO1, VIN_LDO23

2.8

5.5

V

VIO_IN

1.62

5.5

V

Average lifetime operating current. QFN. (Note 1)

SW_B2, SW_B3, SW_B4

SW_B1

1.6

3.2

A

Operating Junction Temperature

-40

105

°C

Note1: This temperature range is used for lifetime reliability testing.