5

LM10504

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SNVS739F – DECEMBER 2011 – REVISED OCTOBER 2016

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Copyright © 2011–2016, Texas Instruments Incorporated

(1)

Stresses beyond those listed under Absolute Maximum Ratings may cause permanent damage to the device. These are stress ratings

only, which do not imply functional operation of the device at these or any other conditions beyond those indicated under Recommended

Operating Conditions. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

If Military/Aerospace specified devices are required, please contact the TI Sales Office/Distributors for availability and specifications.

6 Specifications

6.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)

(1) (2)

MIN

MAX

UNIT

VIN, VCOMP

–0.3

6

V

VIN_IO, VIN_B1, VIN_B2, VIN_B3, SPI_CS, SPI_DI, SPI_CLK, SPI_DO, Vselect_B2,Vselect_B3,

RESET, SW_1, SW_2, SW_3, FB_1, FB_2, FB_3, LDO, Interrupt, DevSLP

–0.3

6

V

Junction temperature, TJ-MAX

150

°C

Storage temperature, Tstg

–65

150

°C

(1)

JEDEC document JEP155 states that 500-V HBM allows safe manufacturing with a standard ESD control process.

6.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human-body model (HBM), per ANSI/ESDA/JEDEC JS-001(1)

±2000

V

(1)

Internal thermal shutdown protects device from permanent damage. Thermal shutdown engages at TJ = 140°C and disengages at

TJ = 120°C (typically). Thermal shutdown is ensured by design.

(2)

In applications where high power dissipation or poor thermal resistance is present, the maximum ambient temperature may have to be

derated. Maximum ambient temperature (TA-MAX) is dependent on the maximum operating junction temperature (TJ-MAX-OP = 125°C), the

maximum power dissipation of the device in the application (PD-MAX), and the junction-to-ambient thermal resistance of the part or

package in the application (RθJA), as given by the following equation: TA-MAX = TJ-MAX-OP – (RθJA × PD-MAX).

(3)

The amount of absolute maximum power dissipation allowed for the device depends on the ambient temperature and can be calculated

using the formula: P = (TJ – TA) / RθJA, where TJ is the junction temperature, TA is the ambient temperature, and RθJA is the junction-to-

ambient thermal resistance. RθJA is highly application and board-layout dependent. Internal thermal shutdown circuitry protects the

device from permanent damage (see Electrical Characteristics – General).

6.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

(1) (2) (3)

MIN

MAX

UNIT

VIN_B1, VIN_B2_VIN_B3, VIN

3

5.5

V

VIN_IO

1.72

3.63

V

All pins other than VIN_IO

0

VIN

V

PD-MAX

Maximum continuous power dissipation

0.9

W

TA

Ambient temperature

–30

85

°C

TJ

Junction temperature

–30

125

°C

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

report.

6.4 Thermal Information

THERMAL METRIC(1)

LM10504

UNIT

YFR (DSBGA)

34 PINS

RθJA

Junction-to-ambient thermal resistance

65.6

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

0.2

°C/W

RθJB

Junction-to-board thermal resistance

39

°C/W

ψJT

Junction-to-top characterization parameter

1.5

°C/W

ψJB

Junction-to-board characterization parameter

38.6

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

—

°C/W