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CDCE937 Datasheet(PDF) 2 Page - Texas Instruments |
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CDCE937 Datasheet(HTML) 2 Page - Texas Instruments |
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2 / 39 page ![]() 2 CDCE937-Q1, CDCEL937-Q1 SCAS892C – FEBRUARY 2010 – REVISED DECEMBER 2016 www.ti.com Product Folder Links: CDCE937-Q1 CDCEL937-Q1 Submit Documentation Feedback Copyright © 2010–2016, Texas Instruments Incorporated Table of Contents 1 Features .................................................................. 1 2 Applications ........................................................... 1 3 Description ............................................................. 1 4 Revision History..................................................... 2 5 Description (continued)......................................... 3 6 Device Comparison Table..................................... 3 7 Pin Configuration and Functions ......................... 4 8 Specifications......................................................... 5 8.1 Absolute Maximum Ratings ...................................... 5 8.2 ESD Ratings.............................................................. 5 8.3 Recommended Operating Conditions ....................... 5 8.4 Thermal Information .................................................. 6 8.5 Electrical Characteristics........................................... 6 8.6 Timing Requirements ................................................ 8 8.7 Typical Characteristics .............................................. 9 9 Parameter Measurement Information ................ 10 10 Detailed Description ........................................... 11 10.1 Overview ............................................................... 11 10.2 Functional Block Diagram ..................................... 12 10.3 Feature Description............................................... 12 10.4 Device Functional Modes...................................... 14 10.5 Programming......................................................... 15 10.6 Register Maps ....................................................... 17 11 Application and Implementation........................ 24 11.1 Application Information.......................................... 24 11.2 Typical Application ................................................ 24 12 Power Supply Recommendations ..................... 28 13 Layout................................................................... 29 13.1 Layout Guidelines ................................................. 29 13.2 Layout Example .................................................... 29 14 Device and Documentation Support ................. 30 14.1 Documentation Support ........................................ 30 14.2 Related Links ........................................................ 30 14.3 Receiving Notification of Documentation Updates 30 14.4 Community Resources.......................................... 30 14.5 Trademarks ........................................................... 30 14.6 Electrostatic Discharge Caution ............................ 30 14.7 Glossary ................................................................ 31 15 Mechanical, Packaging, and Orderable Information ........................................................... 31 4 Revision History NOTE: Page numbers for previous revisions may differ from page numbers in the current version. Changes from Revision B (May 2010) to Revision C Page • Changed Applications............................................................................................................................................................. 1 • Added ESD Ratings table, Feature Description section, Device Functional Modes, Application and Implementation section, Power Supply Recommendations section, Layout section, Device and Documentation Support section, and Mechanical, Packaging, and Orderable Information section .................................................................................................. 1 • Deleted Ordering Information table; see Package Option Addendum at the end of the data sheet ...................................... 1 Changes from Revision A (March 2010) to Revision B Page • Changed the PACKAGE THERMAL RESISTANCE table ..................................................................................................... 6 • Changed RID default in Generic Configuration Register table From: 0h To: Xb ................................................................. 18 • Added note to PWDN description in Generic Configuration Register table ......................................................................... 18 • Changed SLAVE_ADR default value in Generic Configuration Register table From: 00b To: 01b ..................................... 18 |
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