5 Specifications

5.1 Absolute Maximum Ratings

over operating free-air temperature range (unless otherwise noted)(1)

MIN

MAX

UNIT

Vs

Supply Voltage

6

V

VIN+, VIN-

Differential (VIN+) - (VIN-)

–26

26

V

Common - mode

GND – 0.3

50

V

VBUS

Bus Voltage, VBUS1, VBUS2

GND – 0.3

50

V

VIO

SDA, SCL, ALERT, A0, A1, EN

GND – 0.3

6

V

Input current into any pin

5

mA

Open-drain digital output current (SDA, ALERT)

10

mA

TA

Operating Temperature

–55

150

°C

TJ

Junction temperature

150

°C

Tstg

Storage temperature

–65

150

°C

(1)

Operation outside the Absolute Maximum Ratings may cause permanent device damage. Absolute Maximum Ratings do not imply

functional operation of the device at these or any other conditions beyond those listed under Recommended Operating Conditions.

If used outside the Recommended Operating Conditions but within the Absolute Maximum Ratings, the device may not be fully

functional, and this may affect device reliability, functionality, performance, and shorten the device lifetime.

5.2 ESD Ratings

VALUE

UNIT

V(ESD)

Electrostatic discharge

Human body model (HBM), per ANSI/ESDA/JEDEC JS-001, all pins(1)

±3000

V

Charged device model (CDM), per ANSI/ESDA/JEDEC JS-002, all pins(2)

±1000

(1)

JEDEC document JEP155 states that 500V HBM allows safe manufacturing with a standard ESD control process.

(2)

JEDEC document JEP157 states that 250V CDM allows safe manufacturing with a standard ESD control process.

5.3 Recommended Operating Conditions

over operating free-air temperature range (unless otherwise noted)

MIN

NOM

MAX

UNIT

VCM

Common-mode input range

GND – 0.3

48

V

VBUS

VBUS input range

GND – 0.3

48

V

VS

Operating supply range

1.7

5.5

V

TA

Ambient temperature

–40

125

°C

5.4 Thermal Information

THERMAL METRIC(1)

INA2227

UNIT

DSBGA

16 PINS

RθJA

Junction-to-ambient thermal resistance

82.9

°C/W

RθJC(top)

Junction-to-case (top) thermal resistance

0.5

°C/W

RθJB

Junction-to-board thermal resistance

21.7

°C/W

ΨJT

Junction-to-top characterization parameter

0.3

°C/W

YJB

Junction-to-board characterization parameter

21.1

°C/W

RθJC(bot)

Junction-to-case (bottom) thermal resistance

N/A

°C/W

(1)

For more information about traditional and new thermal metrics, see the Semiconductor and IC Package Thermal Metrics application

note.

INA2227

SBOSAL5 – JUNE 2025

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