AFE5804 datasheet(69/82 Pages) TI2

69 / 82 page

ADS5294

www.ti.com

SLAS776E – NOVEMBER 2011 – REVISED APRIL 2018

Product Folder Links: ADS5294

Submit Documentation Feedback

11 Power Supply Recommendations

The device requires three supplies in order to operate properly. These supplies are AVDD and LVDD. All

supplies must be driven with low-noise sources to be able to achieve the best performance from the device.

When determining the drive current needed to drive each of the supplies of the device, a margin of 50-100% over

the typical current might be needed to account for the current consumption across different modes of operation.

Please also refer to Reset Timing after power up.

12 Layout

12.1 Layout Guidelines

A single ground plane is sufficient to give good performance, provided the analog, digital, and clock sections of

the board are cleanly partitioned. See the ADS5294VM Evaluation Module (SLAU355) for placement of

components, routing, and grounding.

Because the ADS5294 already includes internal decoupling, minimal external decoupling can be used without

loss in performance. For example, the ADS5294EVM uses a single 0.1-µF decoupling capacitor for each supply,

placed close to the device supply pins.

The exposed pad at the bottom of the package is the main path for heat dissipation. Solder the pad to a ground

plane on the PCB for best thermal performance. The pad must be connected to the ground plane through the

optimum number of vias.

See TI’s thermal Web site at www.ti.com/thermal for additional information.

AFE5804 Datasheet(PDF) 69 Page - Texas Instruments