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LPC1111FDH20/002 Datasheet(PDF) 58 Page - NXP Semiconductors |
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LPC1111FDH20/002 Datasheet(HTML) 58 Page - NXP Semiconductors |
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58 / 127 page ![]() LPC111X All information provided in this document is subject to legal disclaimers. © NXP Semiconductors N.V. 2014. All rights reserved. Product data sheet Rev. 9.2 — 26 March 2014 58 of 127 NXP Semiconductors LPC1110/11/12/13/14/15 32-bit ARM Cortex-M0 microcontroller 8. Limiting values [1] The following applies to the limiting values: a) This product includes circuitry specifically designed for the protection of its internal devices from the damaging effects of excessive static charge. Nonetheless, it is suggested that conventional precautions be taken to avoid applying greater than the rated maximum. b) Parameters are valid over operating temperature range unless otherwise specified. All voltages are with respect to VSS unless otherwise noted. c) The limiting values are stress ratings only. Operating the part at these values is not recommended, and proper operation is not guaranteed. The conditions for functional operation are specified in Table 16. [2] Maximum/minimum voltage above the maximum operating voltage (see Table 16) and below ground that can be applied for a short time (< 10 ms) to a device without leading to irrecoverable failure. Failure includes the loss of reliability and shorter lifetime of the device. [3] Including voltage on outputs in 3-state mode. [4] VDD present or not present. Compliant with the I2C-bus standard. 5.5 V can be applied to this pin when VDD is powered down. [5] See Table 18 for maximum operating voltage. [6] The maximum non-operating storage temperature is different than the temperature for required shelf life which should be determined based on required shelf lifetime. Please refer to the JEDEC spec (J-STD-033B.1) for further details. [7] Human body model: equivalent to discharging a 100 pF capacitor through a 1.5 k series resistor. Table 12. Limiting values In accordance with the Absolute Maximum Rating System (IEC 60134).[1] Symbol Parameter Conditions Min Max Unit VDD supply voltage (core and external rail) [2] 0.5 +4.6 V VI input voltage 5 V tolerant I/O pins; only valid when the VDD supply voltage is present [2][3] 0.5 +5.5 V 5 V tolerant open-drain pins PIO0_4 and PIO0_5 [2][4] 0.5 +5.5 V VIA analog input voltage pin configured as analog input [2][5] 0.5 4.6 V IDD supply current per supply pin - 100 mA ISS ground current per ground pin - 100 mA Ilatch I/O latch-up current (0.5V DD) < VI < (1.5VDD); Tj < 125 C - 100 mA Tstg storage temperature non-operating [6] 65 +150 C Tj(max) maximum junction temperature - 150 C Ptot(pack) total power dissipation (per package) based on package heat transfer, not device power consumption -1.5 W VESD electrostatic discharge voltage human body model; all pins [7] - +6500 V |
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