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XC2000 Datasheet(PDF) 106 Page - Infineon Technologies AG |
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XC2000 Datasheet(HTML) 106 Page - Infineon Technologies AG |
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106 / 110 page ![]() XC2287 / XC2286 / XC2285 XC2000 Family Derivatives Package and Reliability Preliminary Data Sheet 104 V0.91, 2007-02 Draft Version 5 Package and Reliability In addition to the electrical parameters, the following information ensures proper integration of the XC228x into the target system. 5.1 Packaging These parameters describe the housing rather than the silicon. Table 26 Package Parameters (PG-LQFP-144) Parameter Symbol Limit Values Unit Notes Min. Max. Exposed Pad Dimension Ex × Ey – 6.5 × 6.5 mm – Power Dissipation P DISS –1.0 W – Thermal resistance Junction-Ambient RΘJA – 45 K/W No thermal via 1) 1) Device mounted on a 2-layer or 4-layer board without thermal vias. 36 K/W 4-layer, no pad 2) 2) Device mounted on a 4-layer board with thermal vias, exposed pad not soldered. 22 K/W 4-layer, pad 3) 3) Device mounted on a 4-layer board with thermal vias, exposed pad soldered to the board. |
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