XC2000 datasheet(108/110 Pages) INFINEON

108 / 110 page

XC2287 / XC2286 / XC2285

XC2000 Family Derivatives

Package and Reliability

Preliminary

Data Sheet

106

V0.91, 2007-02

Draft Version

5.2

Thermal Considerations

When operating the XC228x in a system, the total heat generated on the chip must be

dissipated to the ambient environment to prevent overheating and resulting thermal

damages.

The maximum heat that can be dissipated depends on the package and its integration

into the target board. The “Thermal resistance

RΘJA” is a measure for these parameters.

The power dissipation must be limited so the average junction temperature does not

exceed 150 °C.

The difference between junction temperature and ambient temperature is determined by

∆T = (P

INT + PIOSTAT + PIODYN) × R

ΘJA

The internal power consumption is defined as

INT = VDDP × IDDP (see Table 14).

The static external power consumption caused by the output drivers is defined as

IOSTAT = Σ((VDDP-VOH) × IOH) + Σ(VOL × IOL)

The dynamic external power consumption caused by the output drivers (

IODYN) depends

on the capacitive load connected to the respective pins and the switching frequencies.

If the total power dissipation determined for a given system configuration exceeds the

defined limit countermeasures must be taken to ensure proper system operation:

•

Reduce

DDP, if possible in the system

•

Reduce the system frequency

•

Reduce the number of output pins

•

Reduce the load on active output drivers

XC2000 Datasheet(PDF) 108 Page - Infineon Technologies AG