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LPC1766_0.02
© NXP B.V. 2008. All rights reserved.
Objective data sheet
Rev. 00.02 — 12 August 2008
41 of 70
NXP Semiconductors
LPC1766
Fast communication chip
[1]
Typical ratings are not guaranteed. The values listed are at room temperature (25
°C), nominal supply voltages.
[2]
The RTC typically fails when Vi(VBAT) drops below 1.6 V.
[3]
Including voltage on outputs in 3-state mode.
[4]
VDD(3V3) supply voltages must be present.
[5]
3-state outputs go into 3-state mode when VDD(3V3) is grounded.
[6]
Accounts for 100 mV voltage drop in all supply lines.
[7]
Allowed as long as the current limit does not exceed the maximum current allowed by the device.
[8]
On pin VBAT.
[9]
To VSS.
[10] Includes external resistors of 18
Ω± 1 % on D+ and D−.
USB pins
IOZ
OFF-state output
current
0V<VI <3.3 V
-
-
±10
μA
VBUS
bus supply voltage
-
-
5.25
V
VDI
differential input
sensitivity voltage
|(D+) − (D−)|
0.2
--V
VCM
differential common
mode voltage range
includes VDI range
0.8
-
2.5
V
Vth(rs)se
single-ended receiver
switching threshold
voltage
0.8
-
2.0
V
VOL
LOW-level output
voltage for
low-/full-speed
RL of 1.5 kΩ to 3.6 V
-
-
0.18
V
VOH
HIGH-level output
voltage (driven) for
low-/full-speed
RL of 15 kΩ to GND
2.8
-
3.5
V
Ctrans
transceiver capacitance pin to GND
-
-
20
pF
ZDRV
driver output
impedance for driver
which is not high-speed
capable
with 33
Ω series resistor;
steady state drive
[10] 36
-
44.1
Ω
Rpu
pull-up resistance
SoftConnect = ON
1.1
-
1.9
k
Ω
Table 6.
Static characteristics …continued
Tamb = −40 °C to +85 °C for industrial applications, unless otherwise specified.
Symbol
Parameter
Conditions
Min
Typ[1]
Max
Unit
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