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OPA2673 Datasheet(PDF) 5 Page - Texas Instruments |
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OPA2673 Datasheet(HTML) 5 Page - Texas Instruments |
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5 / 40 page ![]() OPA2673 www.ti.com..................................................................................................................................................... SBOS382A – JUNE 2008 – REVISED OCTOBER 2008 ELECTRICAL CHARACTERISTICS: VS = ±6V (continued) At TA = +25°C, A0 = A1 = 0 (full power), G = +4V/V, RF = 402Ω, and RL = 100Ω, unless otherwise noted. See Figure 76 for ac performance only. Single channel specifications, except where noted. OPA2673IDGQ, IRGV MIN/MAX OVER TYP TEMPERATURE 0°C to –40°C to MIN/ TEST PARAMETER CONDITIONS +25°C +25°C(2) 70°C(3) +85°C(3) UNIT MAX LEVEL(1) POWER SUPPLY Specified operating voltage ±6 V typ C Maximum operating voltage ±6.5 ±6.5 ±6.5 V max A Minimum operating voltage ±3.5 V typ C Maximum quiescent current at full power VS = ±6V, Total both channels, 32 38 40 42 mA max A A1 = 0, A0 = 0 Minimum quiescent current at full power VS = ±6V, Total both channels, 32 26 25 24 mA min A A1 = 0, A0 = 0 Supply current at 75% bias VS = ±6V, Total both channels, 24 29 31 33 mA max A A1 = 0, A0 = 1 Supply current at 50% bias VS = ±6V, Total both channels, 16 19 20 21 mA max A A1 = 1, A0 = 0 Supply current (off-line) VS = ±6V, Total both channels, 5.5 7 7.5 8 mA max A A1 = 1, A0 = 1 Supply current step time Power-supply rejection ratio (–PSRR) Input-referred 54 49 48 47 dB min A THERMAL CHARACTERISTICS Specified operating temperature range IRGV, IDGQ packages –40 to °C typ C +85 Thermal resistance, θ JA Junction-to-ambient RGV QFN-16 PowerPAD soldered to PCB 45 °C/W typ C PowerPAD floating(7) 75 DGQ MSOP-10 PowerPAD soldered to PCB 40 °C/W typ C (7) PowerPad is physically connected to the negative (-VS) supply for dual-supply configuration or ground (GND) for single-supply configuration. Copyright © 2008, Texas Instruments Incorporated Submit Documentation Feedback 5 Product Folder Link(s): OPA2673 |
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