AD6659 datasheet(9/40 Pages) AD

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AD6659

Rev.

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ABSOLUTE MAXIMUM RATINGS

THERMAL CHARACTERISTICS

Table 6.

Parameter

Rating

AVDD to AGND

−0.3 V to +2.0 V

DRVDD to AGND

−0.3 V to +3.9 V

VIN+A, VIN+B, VIN−A, VIN−B to AGND

−0.3 V to AVDD + 0.2 V

CLK+, CLK− to AGND

−0.3 V to AVDD + 0.2 V

SYNC to AGND

−0.3 V to DRVDD + 0.3 V

VREF to AGND

−0.3 V to AVDD + 0.2 V

SENSE to AGND

−0.3 V to AVDD + 0.2 V

VCM to AGND

−0.3 V to AVDD + 0.2 V

RBIAS to AGND

−0.3 V to AVDD + 0.2 V

CSB to AGND

−0.3 V to DRVDD + 0.3 V

SCLK/DFS to AGND

−0.3 V to DRVDD + 0.3 V

SDIO/DCS to AGND

−0.3 V to DRVDD + 0.3 V

OEB to AGND

−0.3 V to DRVDD + 0.3 V

PDWN to AGND

−0.3 V to DRVDD + 0.3 V

D0x through D11x to AGND

−0.3 V to DRVDD + 0.3 V

DCOx to AGND

−0.3 V to DRVDD + 0.3 V

Operating Temperature Range

(Ambient)

−40°C to +85°C

Maximum Junction Temperature

Under Bias

150°C

Storage Temperature Range

(Ambient)

−65°C to +150°C

The exposed paddle is the only ground connection for the chip.

The exposed paddle must be soldered to the AGND plane of the

user’s circuit board. Soldering the exposed paddle to the user’s

board also increases the reliability of the solder joints and

maximizes the thermal capability of the package.

Typical θJA is specified for a 4-layer PCB with a solid ground

plane. As listed in Table 7, airflow improves heat dissipation,

which reduces θJA. In addition, metal in direct contact with the

package leads from metal traces, through holes, ground, and

power planes, reduces the θJA.

Table 7. Thermal Resistance

Airflow

Package Type

Velocity

(m/sec)

θJA1,2

1, 3

1, 4

64-Lead LFCSP

9 mm × 9 mm

(CP-64-4)

C/W

23°C

2.0°

1.0

2°C/W

20°C/W

2.5

18°C/W

1 Per JEDEC 51-7, plus JED

oving air).

EC 25-5 2S2P test board.

2 Per JEDEC JESD51-2 (still air) or JEDEC JESD51-6 (m

3 Per MIL-STD 883, Method 1012.1.

4 Per JEDEC JESD51-8 (still air).

ESD CAUTION

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

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