DAC8728 datasheet(2/52 Pages) TI

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DAC8728

SBAS466A – JUNE 2009 – REVISED NOVEMBER 2009

www.ti.com

This integrated circuit can be damaged by ESD. Texas Instruments recommends that all integrated circuits be handled with

appropriate precautions. Failure to observe proper handling and installation procedures can cause damage.

ESD damage can range from subtle performance degradation to complete device failure. Precision integrated circuits may be more

susceptible to damage because very small parametric changes could cause the device not to meet its published specifications.

ORDERING INFORMATION(1)

RELATIVE

DIFFERENTIAL

SPECIFIED

ACCURACY

LINEARITY

PACKAGE-

PACKAGE

TEMPERATURE

PACKAGE

PRODUCT

(LSB)

LEAD

DESIGNATOR

RANGE

MARKING

±4

±1

QFN-56

RTQ

–40°C to +105°C

DAC8728

±4

±1

TQFP-64

PAG

–40°C to +105°C

DAC8728

(1)

For the most current package and ordering information, see the Package Option Addendum at the end of this data sheet, or see the TI

website at www.ti.com.

ABSOLUTE MAXIMUM RATINGS

(1)

Over operating free-air temperature range (unless otherwise noted).

DAC8728

UNIT

AVDD to AVSS

–0.3 to 38

AVDD to AGND

–0.3 to 38

AVSS to AGND, DGND

–19 to 0.3

DVDD to DGND

–0.3 to 6

IOVDD to DGND

–0.3 to DVDD + 0.3

AGND to DGND

–0.3 to 0.3

Digital input voltage to DGND

–0.3 to IOVDD + 0.3

VOUT-x, VMON to AVSS

–0.3 to AVDD + 0.3

REF-A, REF-B to AGND

–0.3 to DVDD

BUSY, GPIO to DGND

–0.3 to IOVDD + 0.3

Maximum current from VMON

Operating temperature range

–40 to +105

°C

Storage temperature range

–65 to +150

°C

Maximum junction temperature (TJ max)

+150

°C

Human body model (HBM)

TQFP

1000

ESD ratings

Charged device model (CDM)

QFN

500

Machine model (MM)

200

TQFP

°C/W

Junction-to-ambient,

θJA

QFN

21.7

°C/W

Thermal impedance

TQFP

°C/W

Junction-to-case,

θJC

QFN

20.4

°C/W

Power dissipation

(TJ max – TA) / θJA

(1)

Stresses above those listed under Absolute Maximum Ratings may cause permanent damage to the device. Exposure to absolute

maximum conditions for extended periods may affect device reliability.

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