DLPC200

DLPS014A – APRIL 2010 – REVISED MAY 2010

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POWER UP REQUIREMENTS

Details about the chip power up requirements are included in the DLPZ004 Chipset datasheet. For the DLPC200,

there is a 50 MHz reference clock that must meet the specifications listed in the table below. Additionally, at

power up, the 3.3 V supply must be stable for 2 seconds before the global reset (RESET) occurs and then

PWR_GOOD occurs within 20 msec.

Table 2. Reference Clock Oscillator Requirements

PART NUMBER

FREQUENCY STABILITY

FREQUENCY

SUPPLY VOLTAGE

ASV-50.000MHZ-E-J-T

±20 ppm (0.002% or ±0.001 MHz)

50 MHz

3.3 V

ABSOLUTE MAXIMUM RATINGS

(1)

over operating free-air temperature range (unless otherwise noted)

PARAMETER

CONDITIONS

VALUE

UNIT

–0.5 V to 1.80

–0.5 V to 3.90

V

–0.5 V to 3.75

-0.5 V to 1.80

1.8 V, 2.5 V, 3.3 V

–0.5 V to 3.95

V

Operating junction temperature range

–40°C to 125

°C

Storage temperature range

–65°C to 150

°C

HBM

Electrostatic discharge voltage using the Human

± 2000

V

Body Model

CD

Electrostatic discharge voltage using the Charged

± 500

V

Device Model

(1)

Stresses beyond those listed under “absolute maximum ratings” may cause permanent damage to the device. These are stress ratings

only, and functional operation of the device at these or any other conditions beyond those indicated under “recommended operating

conditions” is not implied. Exposure to absolute-maximum-rated conditions for extended periods may affect device reliability.

(2)

All voltage values are with respect to GND, and at the device not at the power supply.

(3)

Applies to external input and bidirectional buffers.

RECOMMENDED OPERATING CONDITIONS

over operating free-air temperature range (unless otherwise noted)

PARAMETER

CONDITIONS

MIN

NOM

MAX

UNIT

1.2-V supply voltage, core logic

1.15

1.2

1.25

V

1.5-V supply voltage, HSTL output

1.71

1.8

1.89

V

buffers

2.5-V analog voltage for PLL regulator

2.375

2.5

2.625

V

1.2-V supply voltage, for PLL

1.15

1.2

1.25

V

Input voltage

–0.5

3.6

V

Output voltage

0

V

Power supply ramp time

50 us

3 ms

-

0

70

°C

Case-to-ambient thermal resistance

temperature

°C/W

P = Power

(1)

Heat sink not required for 0 to 55, but for 55 to 70, low profile (15 mm) heat sink recommended

Thermal Considerations

be exceeded (see Recommended Operating Conditions). This temperature is dependent on operating ambient

temperature, airflow, PCB design (including the component layout density and the amount of copper used),

power dissipation of the DLPC200 and power dissipation of surrounding components. The DLPC200’s package

is designed primarily to extract heat through the power and ground planes of the PCB, thus copper content and

airflow over the PCB are important factors.

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