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641 Datasheet(PDF) 76 Page - Intel Corporation |
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641 Datasheet(HTML) 76 Page - Intel Corporation |
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76 / 106 page ![]() Thermal Specifications and Design Considerations 76 Datasheet The case temperature is defined at the geometric top center of the processor. Analysis indicates that real applications are unlikely to cause the processor to consume maximum power dissipation for sustained time periods. Intel recommends that complete thermal solution designs target the Thermal Design Power (TDP) indicated in Table 26 instead of the maximum processor power consumption. The Thermal Monitor feature is designed to protect the processor in the unlikely event that an application exceeds the TDP recommendation for a sustained periods of time. For more details on the usage of this feature, refer to Section 5.2. In all cases the Thermal Monitor or Thermal Monitor 2 feature must be enabled for the processor to remain within specification. Table 26. Processor Thermal Specifications for 775_VR_CONFIG_05A Processors Processor Number Core Frequency (GHz) Thermal Design Power (W) Minimum TC (°C) Maximum TC (°C) Notes 631 3 GHz 86 5 See Table 28 and Figure 12 1, 2 NOTES: 1. Thermal Design Power (TDP) should be used for processor thermal solution design targets. The TDP is not the maximum power that the processor can dissipate. 2. This table shows the maximum TDP for a given frequency range. Individual processors may have a lower TDP. Therefore, the maximum TC will vary depending on the TDP of the individual processor. Refer to Table 28 and Figure 12 for the allowed combinations of power and TC. 641 3.20 GHz 86 5 See Table 28 and Figure 12 1, 2 651 3.40 GHz 86 5 See Table 28 and Figure 12 1, 2 661 3.60 GHz 86 5 See Table 28 and Figure 12 1, 2 Table 27. Processor Thermal Specifications for 775_VR_CONFIG_06 Processors Processor Number Core Frequency (GHz) Thermal Design Power (W) Minimum TC (°C) Maximum TC (°C) Notes 631 641 651 3 GHz 3.20 GHz 3.40 GHz 65 65 65 5 5 5 See Table 29and Figure 13 1, 2 NOTES: 1. Thermal Design Power (TDP) should be used for processor thermal solution design targets. The TDP is not the maximum power that the processor can dissipate. 2. This table shows the maximum TDP for a given frequency range. Individual processors may have a lower TDP. Therefore, the maximum TC will vary depending on the TDP of the individual processor. Refer to thermal profile figure and associated table for the allowed combinations of power and TC. |
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