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Datasheet

Electrical Specifications

VTT_OUT_LEFT

and

VTT_OUT_RIGHT

ICC

DC Current that may be drawn from

VTT_OUT_LEFT and VTT_OUT_RIGHT per

—

580

ITT

Steady-state FSB termination current

—

3.5

15, 16

ITT_POWER-UP

Power-up FSB termination current

—

4.5

15, 17

ICC_VCCA

ICC for PLL lands

—

ICC_VCCIOPLL

ICC for I/O PLL land

—

ICC_GTLREF

ICC for GTLREF

—

200

µA

NOTES:

1. Unless otherwise noted, all specifications in this table are based on estimates and simulations or empirical data. These

specifications will be updated with characterized data from silicon measurements at a later date.

2. Adherence to the voltage specifications for the processor are required to ensure reliable processor operation.

3. Each processor is programmed with a maximum valid voltage identification value (VID) that is set at manufacturing and can

not be altered. Individual maximum VID values are calibrated during manufacturing such that two processors at the same

frequency may have different settings within the VID range. Note that this differs from the VID employed by the processor

during a power management event (Thermal Monitor 2, Enhanced Intel SpeedStep technology, or Enhanced HALT State).

These voltages are targets only. A variable voltage source should exist on systems in the event that a different

voltage is required. See Section 2.3 and Table 2 for more information.

5. The voltage specification requirements are measured across VCC_SENSE and VSS_SENSE lands at the socket with a 100 MHz

bandwidth oscilloscope, 1.5 pF maximum probe capacitance, and 1 M

Ω minimum impedance. The maximum length of ground

wire on the probe should be less than 5 mm. Ensure external noise from the system is not coupled into the oscilloscope probe.

Refer to Table 5 and Figure 1 for the minimum, typical, and maximum VCC allowed for a given current. The

processor should not be subjected to any VCC and ICC combination wherein VCC exceeds VCC_MAX for a given

current.

7. ICC_MAX is specified at VCC_MAX.

8. The current specified is also for AutoHALT State.

9. ICC Stop-Grant is specified at VCC_MAX.

10.ISGNT and IENHANCED_AUTO_HALT are specified at VCC_TYP and TC = 50 °C.

11.These parameters are based on design characterization and are not tested.

12.The maximum instantaneous current the processor will draw while the thermal control circuit is active (as indicated by the

assertion of PROCHOT#) is the same as the maximum ICC for the processor.

13.VTT must be provided via a separate voltage source and not be connected to VCC. This specification is measured at the land.

14.Baseboard bandwidth is limited to 20 MHz.

15.

This is maximum total current drawn from VTT plane by only the processor. This specification does not include

the current coming from RTT (through the signal line). Refer to the Voltage Regulator-Down (VRD) 10.1 Design Guide

For Desktop and Transportable LGA775 Socket

to determine the total ITT drawn by the system.

16.This is a steady-state ITT current specification, which is applicable when both VTT and VCC are high.

17.This is a power-up peak current specification that is applicable when VTT is high and VCC is low.

Table 4.

Voltage and Current Specification

Symbol

Parameter

Min

Typ

Max

Unit

Notes1, 2

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