641 datasheet(10/106 Pages) INTEL

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Introduction

Datasheet

The processor includes an address bus powerdown capability that removes power from

the address and data signals when the FSB is not in use. This feature is always enabled

on the processor.

Enhanced Intel® SpeedStep® technology allows trade-offs to be made between

performance and power consumptions. This may lower average power consumption (in

conjunction with OS support).

1.1

Terminology

A ‘#’ symbol after a signal name refers to an active low signal, indicating a signal is in

the active state when driven to a low level. For example, when RESET# is low, a reset

has been requested. Conversely, when NMI is high, a nonmaskable interrupt has

occurred. In the case of signals where the name does not imply an active state but

describes part of a binary sequence (such as address or data), the ‘#’ symbol implies

that the signal is inverted. For example, D[3:0] = ‘HLHL’ refers to a hex ‘A’, and

D[3:0]# = ‘LHLH’ also refers to a hex ‘A’ (H= High logic level, L= Low logic level).

Front Side Bus refers to the interface between the processor and system core logic

(a.k.a. the chipset components). The FSB is a multiprocessing interface to processors,

memory, and I/O.

1.1.1

Processor Packaging Terminology

Commonly used terms are explained here for clarification:

• Intel® Pentium® 4 processor on 65 nm process in the 775-land package —

Processor in the FC-LGA6 package with a 2 MB L2 cache.

• Processor — For this document, the term processor is the generic form of the

Intel® Pentium® 4 processor 6x1 sequence on 65 nm process in the 775-land

package.

• Keep-out zone — The area on or near the processor that system design can not

utilize.

• Intel® 945G/945GZ/945P/945PL Express chipsets — Chipset that supports

DDR and DDR2 memory technology for the Pentium 4 processor.

• Processor core — Processor core die with integrated L2 cache.

• LGA775 socket — The Pentium 4 processor mates with the system board through

a surface mount, 775-land, LGA socket.

• Integrated heat spreader (IHS) —A component of the processor package used

to enhance the thermal performance of the package. Component thermal solutions

interface with the processor at the IHS surface.

• Retention mechanism (RM) — Since the LGA775 socket does not include any

mechanical features for heatsink attach, a retention mechanism is required.

Component thermal solutions should attach to the processor via a retention

mechanism that is independent of the socket.

• FSB (Front Side Bus) — The electrical interface that connects the processor to

the chipset. Also referred to as the processor system bus or the system bus. All

memory and I/O transactions as well as interrupt messages pass between the

processor and chipset over the FSB.

• Storage conditions — Refers to a non-operational state. The processor may be

installed in a platform, in a tray, or loose. Processors may be sealed in packaging or

exposed to free air. Under these conditions, processor lands should not be

connected to any supply voltages, have any I/Os biased, or receive any clocks.

Upon exposure to “free air”(i.e., unsealed packaging or a device removed from

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