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641 Datasheet(PDF) 82 Page - Intel Corporation |
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641 Datasheet(HTML) 82 Page - Intel Corporation |
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82 / 106 page ![]() Thermal Specifications and Design Considerations 82 Datasheet 5.2.4 PROCHOT# Signal An external signal, PROCHOT# (processor hot), is asserted when the processor die temperature has reached its maximum operating temperature. If the Thermal Monitor is enabled (note that the Thermal Monitor must be enabled for the processor to be operating within specification), the TCC will be active when PROCHOT# is asserted. The processor can be configured to generate an interrupt upon the assertion or de- assertion of PROCHOT#. Refer to the Intel® 64 and IA-32 Architecture Software Developer’s Manuals for specific register and programming details. The processor implements a bi-directional PROCHOT# capability to allow system designs to protect various components from over-temperature situations. The PROCHOT# signal is bi-directional in that it can either signal when the processor has reached its maximum operating temperature or be driven from an external source to activate the TCC. The ability to activate the TCC via PROCHOT# can provide a means for thermal protection of system components. One application is the thermal protection of voltage regulators (VR). System designers can create a circuit to monitor the VR temperature and activate the TCC when the temperature limit of the VR is reached. By asserting PROCHOT# (pulled-low) and activating the TCC, the VR can cool down as a result of reduced processor power consumption. Bi-directional PROCHOT# can allow VR thermal designs to target maximum sustained current instead of maximum current. Systems should still provide proper cooling for the VR, and rely on bi-directional PROCHOT# only as a backup in case of system cooling failure. Refer to the Voltage Regulator-Down (VRD) 10.1 Design Guide For Desktop and Transportable LGA775 Socket for details on implementing the bi-directional PROCHOT# feature. 5.2.5 THERMTRIP# Signal Regardless of whether or not Thermal Monitor or Thermal Monitor 2 is enabled, in the event of a catastrophic cooling failure, the processor will automatically shut down when the silicon has reached an elevated temperature (refer to the THERMTRIP# definition in Table 25). At this point, the FSB signal THERMTRIP# will go active and stay active as described in Table 25. THERMTRIP# activation is independent of processor activity and does not generate any bus cycles. 5.2.6 TCONTROL and Fan Speed Reduction TCONTROL is a temperature specification based on a temperature reading from the thermal diode. The value for TCONTROL will be calibrated in manufacturing and configured for each processor. When TDIODE is above TCONTROL, TC must be at or below TC-MAX as defined by the thermal profile in Table 28 and Figure 12; otherwise, the processor temperature can be maintained at TCONTROL (or lower) as measured by the thermal diode. The purpose of this feature is to support acoustic optimization through fan speed control. Contact your Intel representative for further details and documentation. 5.2.7 Thermal Diode The processor incorporates an on-die PNP transistor whose base emitter junction is used as a thermal "diode", with its collector shorted to Ground. A thermal sensor located on the system board may monitor the die temperature of the processor for thermal management and fan speed control. Table 30, Table 31, Table 32, and Table 33 provide the "diode" parameter and interface specifications. Two different sets of "diode" parameters are listed in Table 30 and Table 31. The Diode Model parameters (Table 30) apply to traditional thermal sensors that use the Diode Equation to determine the |
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