641 datasheet(99/106 Pages) INTEL

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Datasheet

Balanced Technology Extended (BTX) Boxed Processor Specifications

Document, Balanced Technology Extended (BTX) System Design Guide, and the

appropriate processor Thermal and Mechanical Design Guidelines (see Section 1.2) for

more detailed information regarding the support and retention module and chassis

interface and keepout zones. Figure 29 illustrates the assembly stack including the

SRM.

8.2

Electrical Requirements

8.2.1

Thermal Module Assembly Power Supply

The boxed processor's Thermal Module Assembly (TMA) requires a +12 V power

supply. The TMA will include power cable to power the integrated fan and will plug into

the 4-wire fan header on the baseboard. The power cable connector and pinout are

shown in Figure 30. Baseboards must provide a compatible power header to support

the boxed processor. Table 36 contains specifications for the input and output signals at

the TMA.

The TMA outputs a SENSE signal, which is an open- collector output that pulses at a

rate of 2 pulses per fan revolution. A baseboard pull-up resistor provides VOH to match

the system board-mounted fan speed monitor requirements, if applicable. Use of the

SENSE signal is optional. If the SENSE signal is not used, pin 3 of the connector should

be tied to GND.

The TMA receives a Pulse Width Modulation (PWM) signal from the motherboard from

the 4th pin of the connector labeled as CONTROL.

Figure 29.

Assembly Stack Including the Support and Retention Module

Thermal Module Assembly

•Heatsink & Fan

• Clip

•Structural Duct

Motherboard

SRM

Chassis Pan

641 Datasheet(PDF) 99 Page - Intel Corporation