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Balanced Technology Extended (BTX) Boxed Processor Specifications

8.3

Thermal Specifications

This section describes the cooling requirements of the thermal module assembly

solution used by the boxed processor.

8.3.1

Boxed Processor Cooling Requirements

The boxed processor may be directly cooled with a TMA. However, meeting the

processor's temperature specification is also a function of the thermal design of the

entire system, and ultimately the responsibility of the system integrator. The processor

case temperature specification is in Chapter 5. The boxed processor TMA is able to

keep the processor temperature within the specifications in Table 26 for chassis that

provide good thermal management. For the boxed processor TMA to operate properly,

it is critical that the airflow provided to the TMA is unimpeded. Airflow of the TMA is into

the duct and out of the rear of the duct in a linear flow. Blocking the airflow to the TMA

inlet reduces the cooling efficiency and decreases fan life. Filters will reduce or impede

airflow which will result in a reduced performance of the TMA. The air temperature

entering the fan should be kept below 35.5°C. Again, meeting the processor's

temperature specification is the responsibility of the system integrator.

Figure 31.

Balanced Technology Extended (BTX) Mainboard Power Header Placement

(Hatched Area)

641 Datasheet(PDF) 101 Page - Intel Corporation