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641 Datasheet(PDF) 89 Page - Intel Corporation |
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641 Datasheet(HTML) 89 Page - Intel Corporation |
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89 / 106 page ![]() Datasheet 89 Boxed Processor Specifications 7 Boxed Processor Specifications The Intel Pentium 4 processor will also be offered as an Intel boxed processor. Intel boxed processors are intended for system integrators who build systems from baseboards and standard components. The boxed Pentium 4 processor will be supplied with a cooling solution. This chapter documents baseboard and system requirements for the cooling solution that will be supplied with the boxed Pentium 4 processor. This chapter is particularly important for OEMs that manufacture baseboards for system integrators. Unless otherwise noted, all figures in this chapter are dimensioned in millimeters and inches [in brackets]. Figure 17 shows a mechanical representation of a boxed Pentium 4 processor. Note: Drawings in this section reflect only the specifications on the Intel boxed processor product. These dimensions should not be used as a generic keep-out zone for all cooling solutions. It is the system designers’ responsibility to consider their proprietary cooling solution when designing to the required keep-out zone on their system platforms and chassis. Refer to the appropriate processor Thermal and Mechanical Design Guidelines (see Section 1.2) for further guidance. NOTE: The airflow of the fan heatsink is into the center and out of the sides of the fan heatsink. 7.1 Mechanical Specifications 7.1.1 Boxed Processor Cooling Solution Dimensions This section documents the mechanical specifications of the boxed Pentium 4 processor. The boxed processor will be shipped with an unattached fan heatsink. Figure 17 shows a mechanical representation of the boxed Pentium 4 processor. Clearance is required around the fan heatsink to ensure unimpeded airflow for proper cooling. The physical space requirements and dimensions for the boxed processor with assembled fan heatsink are shown in Figure 18 (Side View), and Figure 19 (Top View). The airspace requirements for the boxed processor fan heatsink must also be incorporated into new baseboard and system designs. Airspace requirements are shown in Figure 23 and Figure 24. Note that some figures have centerlines shown (marked with alphabetic designations) to clarify relative dimensioning. Figure 17. Mechanical Representation of the Boxed Processor |
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