AD9146 datasheet(7/52 Pages) AD

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AD9146

Rev. 0 | Page 7 of 52

ABSOLUTE MAXIMUM RATINGS

THERMAL RESISTANCE

Table 6.

Parameter

Rating

AVDD33 to AVSS, EPAD, CVSS

−0.3 V to +3.6 V

DVDD18, CVDD18 to AVSS, EPAD,

CVSS

−0.3 V to +2.1 V

AVSS to EPAD, CVSS

−0.3 V to +0.3 V

EPAD to AVSS, CVSS

−0.3 V to +0.3 V

CVSS to AVSS, EPAD

−0.3 V to +0.3 V

FSADJ, REFIO, IOUT1P, IOUT1N,

IOUT2P, IOUT2N to AVSS

−0.3 V to AVDD33 + 0.3 V

D[7:0]P, D[7:0]N, FRAMEP, FRAMEN,

DCIP, DCIN to EPAD

−0.3 V to DVDD18 + 0.3 V

DACCLKP, DACCLKN, REFCLKP,

REFCLKN to EPAD

−0.3 V to CVDD18 + 0.3 V

RESET, IRQ, CS, SCLK, SDIO to EPAD

−0.3 V to DVDD18 + 0.3 V

Junction Temperature

125°C

Storage Temperature Range

−65°C to +150°C

The exposed pad (EPAD) of the 48-lead LFCSP must be soldered

to the ground plane (AVSS). The EPAD provides an electrical,

thermal, and mechanical connection to the board.

Typical θJA, θJB, and θJC values are specified for a 4-layer board and

an 8-layer board in still air. Airflow increases heat dissipation,

effectively reducing θJA and θJB.

Table 7. Thermal Resistance

Package1

PCB

θJA

θJB

θJC

Unit

48-Lead LFCSP

4-layer

23.2

8.5

8.7

°C/W

48-Lead LFCSP

8-layer

16.4

3.9

7.1

°C/W

1 EPAD soldered to ground plane.

ESD CAUTION

Stresses above those listed under Absolute Maximum Ratings

may cause permanent damage to the device. This is a stress

rating only; functional operation of the device at these or any

other conditions above those indicated in the operational

section of this specification is not implied. Exposure to absolute

maximum rating conditions for extended periods may affect

device reliability.

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