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LPC1850 Datasheet(PDF) 152 Page - NXP Semiconductors

Part # LPC1850
Description  32-bit ARM Cortex-M3 MCU; up to 200 kB SRAM; Ethernet, two High-speed USB, LCD, and external memory controller
PDF  157 Pages
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Manufacturer  PHILIPS [NXP Semiconductors]
Direct Link  http://www.nxp.com
Logo PHILIPS - NXP Semiconductors

LPC1850 Datasheet(HTML) 152 Page - NXP Semiconductors

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LPC1850_30_20_10
All information provided in this document is subject to legal disclaimers.
© NXP B.V. 2011. All rights reserved.
Preliminary data sheet
Rev. 3 — 6 December 2011
152 of 157
NXP Semiconductors
LPC1850/30/20/10
32-bit ARM Cortex-M3 microcontroller
LPC1850_30_20_10 v.2
20110713
Objective data sheet
-
LPC1850_30_20_10 v.1.2
Modifications:
• Power consumption data added (Figure 12 to Figure 17).
• Pin PC_0 in Table 3: function ENET_RX_CLK changed to n.c. and function
SDIO_CLK changed to function ENET_RX_CLK.
• Pin PC_8 in Table 3: ENET_RX_DV applies to RMII/MII interfaces.
• Rename pins CAN1_RD and CAN1_TD to CAN0_RD and CAN0_TD in Table 3.
• Rename all I2S pins to I2S0 pins.
• Condition for RTC operation updated in Table 8, Table note 2.
• Figure 11 “LPC1850/30/20/10 Power domains” added.
• “n.c.” changed to “Reserved” in Table 3.
• Section 11.6: characterization parameters and timing diagrams updated.
• Prefix for all SD/MMC pins changed to “SD” in Table 3.
• Prefix for all EMC pins changed to “EMC” in Table 3.
• Section 11.4 added.
• Section 11.8 added.
• Section 11.9 added.
• LQFP144 pinout added in Table 3.
• Updates related to the Rev ‘A’ version of parts LPC1850/30/20/10:
– Pin P6_0 in Table 3: function I2S_RX_SCK moved to function level 5.
– Pin PF_0 in Table 3: function GP_CLKIN added.
– Pin PA_1 in Table 3: function U2_TXD added.
– Pin PA_2 in Table 3: function U2_RXD added.
– Pin PC_0 in Table 3: reset state changed to I; PU.
– Pin P1_16 in Table 3: ENET_CRS_DV moved to function level 7.
– Pad descriptions updated in Table 3, Table note 3 to Table note 11.
– Added function levels four to seven/eight for each pin in Table 3.
– Second C_CAN interface (C_CAN1) added.
– Second I2S interface (I2S1) added.
– Audio PLL added (Section 2 and Section 7.18.6).
– All SDIO functions moved to the function levels four to seven in Table 3.
– High-speed GPIO block moved to address 0x400F 4000 in Figure 9 and
Figure 10.
– GPIO interrupts and GPIO group0 and group1 interrupt added in Figure 1,
Figure 9, Figure 10, Section 2, and Section 7.12.
– Number of GPIO ports increased to eight.
– Total number of GPIO pins increased to 164.
– GIMA block added (Section 7.6).
– Band gap output added to pin PF_7.
– Package outline and soldering information added for all packages.
Table 35.
Revision history …continued
Document ID
Release date Data sheet status
Change notice
Supersedes



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