AFE030 datasheet(47/58 Pages) TI1

47 / 58 page

AFE030

www.ti.com

SBOS588A

– DECEMBER 2011 – REVISED DECEMBER 2011

Table 19 lists several recommended transient protection components.

Table 19. Recommended Transient Protection Devices

120 VAC, 60 Hz

COMPONENT

DESCRIPTION

MANUFACTURER

MFR PART NO (OR EQUIVALENT)

Zener diode

Diodes, Inc.

1SMB59xxB(1)

D2, D3

Schottky diode

Diodes, Inc.

1N5819HW

TVS

Transient voltage suppressor

Diodec Semiconductor

P6SMBJxxC(2)

MOV

Varistor

LittleFuse

TMOV20RP140E

HV Cap

High-voltage capacitor

Illinois Capacitor, Inc

474MKP275KA(3)

240 VAC, 50 Hz

COMPONENT

DESCRIPTION

MANUFACTURER

MFR PART NO (OR EQUIVALENT)

Zener diode

Diodes, Inc.

1SMB59xxB(1)

D2, D3

Schottky diode

Diodes, Inc.

1N5819HW

TVS

Transient voltage suppressor

Diodec Semiconductor

P6SMBJxxC(2)

MOV

Varistor

LittleFuse

TMOV20RP300E

HV Cap

High-voltage capacitor

Illinois Capacitor, Inc

474MKP275KA(3)

(1)

Select the Zener breakdown voltage at the lowest available rating beyond the normal power-supply operating range.

(2)

Select the TVS breakdown voltage at or slightly greater than (0.5

× PA_VS).

(3)

A common value for the high-voltage capacitor is 470 nF. Other values may be substituted depending on the requirements of the

application. Note that when making a substitution, it is important in terms of reliability that the capacitor be selected from the same

familiy or equivalent family of capacitors rated to withstand high-voltage surges.

THERMAL CONSIDERATIONS

In a typical powerline communications application, the AFE030 dissipates 1 W of power when transmitting into

the low impedance of the ac line. This amount of power dissipation can increase the junction temperature, which

in turn can lead to a thermal overload that results in signal transmission interruptions if the proper thermal design

of the PCB has not been performed. Proper management of heat flow from the AFE030 as well as good PCB

design and construction are required to ensure proper device temperature, maximize performance, and extend

device operating life.

The AFE030 is assembled into a 7-mm2 x 7-mm2, 48-lead, QFN package. As Figure 52 shows, this QFN

package has a large area exposed thermal pad on the underside that is used to conduct heat away from the

AFE030 and into the underlying PCB.

Figure 52. QFN Package with Large Area Exposed Thermal Pad

Product Folder Link(s): AFE030

AFE030 Datasheet(PDF) 47 Page - Texas Instruments

AFE030 Datasheet(HTML) 47 Page - Texas Instruments

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